JAJSPU9M september   2005  – february 2023 SN65HVD30 , SN65HVD31 , SN65HVD32 , SN65HVD33 , SN65HVD34 , SN65HVD35

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
    1.     6
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Driver
    6. 7.6  Electrical Characteristics: Receiver
    7. 7.7  Device Power Dissipation – PD
    8. 7.8  Supply Current Characteristics
    9. 7.9  Switching Characteristics: Driver
    10. 7.10 Switching Characteristics: Receiver
    11. 7.11 Dissipation Ratings
    12. 7.12 Typical Characteristics
      1.      Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Power Standby Mode
      2. 8.3.2 Driver Output Current Limiting
      3. 8.3.3 Hot-Plugging
      4. 8.3.4 Receiver Failsafe
      5. 8.3.5 Safe Operation With Bus Contention
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1)SN65HVD30,
SN65HVD31,
SN65HVD32		SN65HVD33,
SN65HVD34,
SN65HVD35		SN65HVD33UNIT
D
(SOIC)		D
(SOIC)		RHL
(VQFN)
8 PINS14 PINS20 PINS
RθJAJunction-to-ambient thermal resistance116.793.273°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.347.514°C/W
RθJBJunction-to-board thermal resistance63.449.413.7°C/W
ψJTJunction-to-top characterization parameter8.811.20.5°C/W
ψJBJunction-to-board characterization parameter62.648.913.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance——2.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.