JAJSF09B February 2015 – April 2015 SN65LVDS93A-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | SN65LVDS93A-Q1 | UNIT | |
---|---|---|---|
DGG (TSSOP) | |||
56 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 63.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 15.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 32.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 32.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |