JAJSRG4S March   1996  – February 2024 SN74AHC1G14

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBV|5
  • DCK|5
  • DRL|5
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)SN74AHC1G14UNIT
DBV (SOT-23)DCK (SC70)DRL (SOT)
5 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance278289.2271.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance180.5 205.8116.6°C/W
RθJBJunction-to-board thermal resistance184.4 176.289.9°C/W
ψJTJunction-to-top characterization parameter115.4117.617.3°C/W
ψJBJunction-to-board characterization parameter183.4175.189.4°C/W
RθJC(bot) Junction-to-case (bot) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.