JAJSRG4S March   1996  – February 2024 SN74AHC1G14

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBV|5
  • DCK|5
  • DRL|5
サーマルパッド・メカニカル・データ
発注情報

Detailed Design Procedure

  1. Recommended input conditions:
    • For rise time and fall time specifications, see Δt/Δv in the Section 5.3 table.
    • For specified high and low levels, see VIH and VIL in the Section 5.3 table.
    • Inputs and outputs are overvoltage tolerant and can therefore go as high as 5.5 V at any valid VCC.
  2. Recommended output conditions:
    • Load currents must not exceed ±50 mA.
  3. Frequency selection criterion:
    • The effects of frequency upon the power consumption of the device can be studied in CMOS Power Consumption and CPD Calculation, SCAA035.
    • Added trace resistance and capacitance can reduce maximum frequency capability; follow the layout practices listed in the Section 8.4.1 section.