JAJSQB1O October   1995  – July 2024 SN54AHCT244 , SN74AHCT244

PRODMIX  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
        3. 8.1.1.3 Application Curves
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DGV|20
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1)SN74AHCT244UNIT
DBDGVDWNNSPW
20 PINS20 PINS20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance87.2119.2 81.154.977.6116.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance49.134.548.941.742.758.5
RθJBJunction-to-board thermal resistance 51.860.753.835.845.778.7
ψJTJunction-to-top characterization parameter 11.61.219.527.910.212.6
ψJBJunction-to-board characterization parameter 51.260.053.135.745.277.9
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A N/A
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.