SCES593F JULY   2004  – July 2017 SN74AUP1G80

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: TA = 25°C
    6. 6.6  Electrical Characteristics: TA = -40°C to +85°C
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics: CL = 5 pF
    9. 6.9  Switching Characteristics: CL = 10 pF
    10. 6.10 Switching Characteristics: CL = 15 pF
    11. 6.11 Switching Characteristics: CL = 30 pF
    12. 6.12 Operating Characteristics
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Duration
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-Voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VI Input voltage(2) –0.5 4.6 V
VO Voltage range applied to any output in the high-impedance or power-off state(2) –0.5 4.6 V
VO Voltage range applied to any output in the high or low state(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±20 mA
Continuous current through VCC or GND ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See (1)
MIN MAX UNIT
VCC Supply voltage 0.8 3.6 V
VIH High-level input voltage VCC = 0.8 V VCC V
VCC = 1.1 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.6
VCC = 3 V to 3.6 V 2
VIL Low-level input voltage VCC = 0.8 V 0 V
VCC = 1.1 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VCC = 3 V to 3.6 V 0.9
VI Input voltage 0 3.6 V
VO Output voltage 0 VCC V
IOH High-level output current(2) VCC = 0.8 V –20 µA
VCC = 1.1 V –1.1 mA
VCC = 1.4 V –1.7
VCC = 1.65 –1.9
VCC = 2.3 V –3.1
VCC = 3 V –4
IOL Low-level output current(2) VCC = 0.8 V 20 µA
VCC = 1.1 V 1.1 mA
VCC = 1.4 V 1.7
VCC = 1.65 V 1.9
VCC = 2.3 V 3.1
VCC = 3 V 4
Δt/Δv Input transition rise or fall rate VCC = 0.8 V to 3.6 V 200 ns/V
TA Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to assure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004.
(2) Defined by the signal integrity requirements and design-goal priorities.

6.4 Thermal Information

THERMAL METRIC(1) SN74AUP1G80 UNIT
DBV (SOT) DCK (SC70) DRY (SON) DSF (SON) YFP (DSBGA) YZP (DSBGA) DPW (X2SON)
5 PINS 5 PINS 6 PINS 6 PINS 6 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 267.2 284.1 341.1 377.1 125.4 146.2 489.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 191.9 208.5 233.1 187.7 1.9 1.4 226.3 °C/W
RθJB Junction-to-board thermal resistance 101.1 103.1 206.7 236.6 37.2 39.3 352.9 °C/W
ψJT Junction-to-top characterization parameter 83.0 76.6 63.4 29.0 0.5 0.7 38.2 °C/W
ψJB Junction-to-board characterization parameter 100.8 102.3 206.7 236.3 37.5 39.8 352.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a n/a 150.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics: TA = 25°C

over recommended operating free-air temperature range, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.75 × VCC
IOH = –1.7 mA 1.4 V 1.11
IOH = –1.9 mA 1.65 V 1.32
IOH = –2.3 mA 2.3 V 2.05
IOH = –3.1 mA 1.9
IOH = –2.7 mA 3 V 2.72
IOH = –4 mA 2.6
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 V
IOL = 1.1 mA 1.1 V 0.3 × VCC
IOL = 1.7 mA 1.4 V 0.31
IOL = 1.9 mA 1.65 V 0.31
IOL = 2.3 mA 2.3 V 0.31
IOL = 3.1 mA 0.44
IOL = 2.7 mA 3 V 0.31
IOL = 4 mA 0.44
II D or CLK
input		 VI = GND to 3.6 V 0 V to 3.6 V 0.1 µA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.2 µA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 µA
ICC VI = GND or VCC to 3.6 V, IO = 0 0.8 V to 3.6 V 0.5 µA
ΔICC VI = VCC – 0.6 V,(1) IO = 0 3.3 V 40 µA
Ci VI = VCC or GND 0 V 1.5 pF
3.6 V 1.5
Co VO = GND 0 V 3 pF
(1) One input at VCC – 0.6 V, other input at VCC or GND

6.6 Electrical Characteristics: TA = –40°C to +85°C

over recommended operating free-air temperature range, TA = –40°C to +85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN MAX UNIT
VOH IOH = –20 µA 0.8 V to 3.6 V VCC – 0.1 V
IOH = –1.1 mA 1.1 V 0.7 × VCC
IOH = –1.7 mA 1.4 V 1.03
IOH = –1.9 mA 1.65 V 1.3
IOH = –2.3 mA 2.3 V 1.97
IOH = –3.1 mA 1.85
IOH = –2.7 mA 3 V 2.67
IOH = –4 mA 2.55
VOL IOL = 20 µA 0.8 V to 3.6 V 0.1 V
IOL = 1.1 mA 1.1 V 0.3 × VCC
IOL = 1.7 mA 1.4 V 0.37
IOL = 1.9 mA 1.65 V 0.35
IOL = 2.3 mA 2.3 V 0.33
IOL = 3.1 mA 0.45
IOL = 2.7 mA 3 V 0.33
IOL = 4 mA 0.45
II D or CLK
input		 VI = GND to 3.6 V 0 V to 3.6 V 0.5 µA
Ioff VI or VO = 0 V to 3.6 V 0 V 0.6 µA
ΔIoff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.6 µA
ICC VI = GND or VCC to 3.6 V, IO = 0 0.8 V to 3.6 V 0.9 µA
ΔICC VI = VCC – 0.6 V,(1) IO = 0 3.3 V 50 µA
(1) One input at VCC – 0.6 V, other input at VCC or GND

6.7 Timing Requirements

over recommended operating free-air temperature range, TA = –40°C to +85°C (unless otherwise noted) (see Figure 3)
VCC MIN TYP(1) MAX UNIT
fclock Clock frequency 0.8 V 20 MHz
1.2 V ± 0.1 V 80
1.5 V ± 0.1 V 120
1.8 V ± 0.15 V 160
2.5 V ± 0.2 V 220
3.3 V ± 0.3 V 260
tw Pulse duration, CLK high or low 0.8 V 5.5
1.2 V ± 0.1 V 2.5
1.5 V ± 0.1 V 1.5
1.8 V ± 0.15 V 1.6
2.5 V ± 0.2 V 1.7
3.3 V ± 0.3 V 1.9
tsu Setup time before CLK↑ Data high 0.8 V 6.7 3.4 ns
1.2 V ± 0.1 V 2.4
1.5 V ± 0.1 V 1.2
1.8 V ± 0.15 V 0.8
2.5 V ± 0.2 V 0.6
3.3 V ± 0.3 V 0.4
Data low 0.8 V 8.9 3.4 ns
1.2 V ± 0.1 V 2
1.5 V ± 0.1 V 1.3
1.8 V ± 0.15 V 1.1
2.5 V ± 0.2 V 0.8
3.3 V ± 0.3 V 0.7
th Hold time, data after CLK↑ 0.8 V 1 0 ns
1.2 V ± 0.1 V 0
1.5 V ± 0.1 V 0
1.8 V ± 0.15 V 0
2.5 V ± 0.2 V 0
3.3 V ± 0.3 V 0
(1) TA = 25°C

6.8 Switching Characteristics: CL = 5 pF

over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 91 MHz
TA = –40°C to +85°C 90
VCC = 1.2 V ± 0.1 V TA = 25°C 175
TA = –40°C to +85°C 220
VCC = 1.5 V ± 0.1 V TA = 25°C 237
TA = –40°C to +85°C 230
VCC = 1.8 V ± 0.15 V TA = 25°C 269
TA = –40°C to +85°C 240
VCC = 2.5 V ± 0.2 V TA = 25°C 280
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 17.2 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 3.2 7.1 14.9
TA = –40°C to +85°C 2.7 16.3
VCC = 1.5 V ± 0.1 V TA = 25°C 1.9 5 9.8
TA = –40°C to +85°C 2.1 10.3
VCC = 1.8 V ± 0.15 V TA = 25°C 1.7 3.9 7.6
TA = –40°C to +85°C 1.6 8.1
VCC = 2.5 V ± 0.2 V TA = 25°C 1.4 2.8 5.3
TA = –40°C to +85°C 1.2 5.6
VCC = 3.3 V ± 0.3 V TA = 25°C 1.2 2.2 4.1
TA = –40°C to +85°C 1 4.4

6.9 Switching Characteristics: CL = 10 pF

over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 68 MHz
TA = –40°C to +85°C 70
VCC = 1.2 V ± 0.1 V TA = 25°C 128
TA = –40°C to +85°C 170
VCC = 1.5 V ± 0.1 V TA = 25°C 189
TA = –40°C to +85°C 220
VCC = 1.8 V ± 0.15 V TA = 25°C 234
TA = –40°C to +85°C 240
VCC = 2.5 V ± 0.2 V TA = 25°C 273
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 19.4 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 4.4 8.2 16.2
TA = –40°C to +85°C 3.4 17.7
VCC = 1.5 V ± 0.1 V TA = 25°C 3.6 5.8 10.7
TA = –40°C to +85°C 2.6 11.3
VCC = 1.8 V ± 0.15 V TA = 25°C 2.9 4.6 8.4
TA = –40°C to +85°C 2.1 3
VCC = 2.5 V ± 0.2 V TA = 25°C 2.2 3.3 5.9
TA = –40°C to +85°C 1.7 6.3
VCC = 3.3 V ± 0.3 V TA = 25°C 1.9 2.7 4.7
TA = –40°C to +85°C 1.4 4.9

6.10 Switching Characteristics: CL = 15 pF

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 52 MHz
TA = –40°C to +85°C 50
VCC = 1.2 V ± 0.1 V TA = 25°C 98
TA = –40°C to +85°C 130
VCC = 1.5 V ± 0.1 V TA = 25°C 148
TA = –40°C to +85°C 180
VCC = 1.8 V ± 0.15 V TA = 25°C 196
TA = –40°C to +85°C 240
VCC = 2.5 V ± 0.2 V TA = 25°C 249
TA = –40°C to +85°C 250
VCC = 3.3 V ± 0.3 V TA = 25°C 280
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 21.5 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 3 9.1 17.4
TA = –40°C to +85°C 4.1 19
VCC = 1.5 V ± 0.1 V TA = 25°C 3.2 6.5 11.7
TA = –40°C to +85°C 3.2 12.3
VCC = 1.8 V ± 0.15 V TA = 25°C 2.7 4.2 9.2
TA = –40°C to +85°C 2.6 9.8
VCC = 2.5 V ± 0.2 V TA = 25°C 2.2 3.8 6.5
TA = –40°C to +85°C 2.1 6.9
VCC = 3.3 V ± 0.3 V TA = 25°C 1.9 3.1 5.1
TA = –40°C to +85°C 1.8 5.5

6.11 Switching Characteristics: CL = 30 pF

over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN TYP MAX UNIT
fmax VCC = 0.8 V TA = 25°C 32 MHz
TA = –40°C to +85°C 20
VCC = 1.2 V ± 0.1 V TA = 25°C 71
TA = –40°C to +85°C 80
VCC = 1.5 V ± 0.1 V TA = 25°C 104
TA = –40°C to +85°C 120
VCC = 1.8 V ± 0.15 V TA = 25°C 133
TA = –40°C to +85°C 160
VCC = 2.5 V ± 0.2 V TA = 25°C 181
TA = –40°C to +85°C 220
VCC = 3.3 V ± 0.3 V TA = 25°C 257
TA = –40°C to +85°C 260
tpd CLK Q VCC = 0.8 V TA = 25°C 28.4 ns
VCC = 1.2 V ± 0.1 V TA = 25°C 5.1 11.8 20.7
TA = –40°C to +85°C 6.2 28.7
VCC = 1.5 V ± 0.1 V TA = 25°C 4.8 8.5 14.1
TA = –40°C to +85°C 6.9 16.7
VCC = 1.8 V ± 0.15 V TA = 25°C 4 6.9 11.2
TA = –40°C to +85°C 2 13.3
VCC = 2.5 V ± 0.2 V TA = 25°C 3.3 5.1 7.9
TA = –40°C to +85°C 3.2 9.3
VCC = 3.3 V ± 0.3 V TA = 25°C 2.9 4.2 6.4
TA = –40°C to +85°C 2.8 7.5

6.12 Operating Characteristics

TA = 25°C
PARAMETER TEST CONDITIONS VCC TYP UNIT
Cpd Power dissipation capacitance f = 10 MHz 0.8 V 4 pF
1.2 V ± 0.1 V 4
1.5 V ± 0.1 V 4
1.8 V ± 0.15 V 4
2.5 V ± 0.2 V 4.1
3.3 V ± 0.3 V 4.3

6.13 Typical Characteristics

SN74AUP1G80 SN74AUP1G80-aup-lw-sces593.gif
† Single, dual, and triple gates
Figure 1. AUP – The Lowest-Power Family
SN74AUP1G80 SN74AUP1G80-ex-sig-sces593.gif
†AUP1G08 data at CL = 15 pF
Figure 2. Excellent Signal Integrity