JAJSVH5M December   2003  – October 2024 SN74AVC2T45

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2 V
    7. 5.7  Switching Characteristics: VCCA = 1.5 V ±0.1 V
    8. 5.8  Switching Characteristics: VCCA = 1.8 V ±0.15 V
    9. 5.9  Switching Characteristics: VCCA = 2.5 V ±0.2 V
    10. 5.10 Switching Characteristics: VCCA = 3.3 V ±0.3 V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.2 V
      2. 5.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.5 V
      3. 5.12.3 Typical Propagation Delay (A-to-B) vs Load Capacitance, TA = 25°C, VCCA = 1.8 V
      4. 5.12.4 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5 V
      5. 5.12.5 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3 V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Isolation
      2. 7.3.2 2-Rail Design
      3. 7.3.3 IO Ports are 4.6-V Tolerant
      4. 7.3.4 Partial-Power-Down Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DCU|8
  • DDF|8
  • YZP|8
  • DCT|8
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)SN74AVC2T45UNIT
DCT (SM8)DCU (VSSOP)

DDF (SOT-23)

YZP (DSBGA)
8 PINS8 PINS

8 PINS

8 PINS
RθJAJunction-to-ambient thermal resistance

194.4

199.3

203.2

105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance

124.7

76.2

121.5

1.6°C/W
RθJBJunction-to-board thermal resistance106.8

80.6

99.8

10.8°C/W
ψJTJunction-to-top characterization parameter

49.8

7.1

21.4

3.1°C/W
ψJBJunction-to-board characterization parameter105.8

80.1

99.5

10.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.