JAJSS78E December   2008  – November 2023 SN74AVC8T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2 V
    7. 5.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 5.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 5.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 5.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Total Static Current Consumption (ICCA + ICCB)
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Configurable Dual-Rail Design
      2. 7.3.2 Supports High Speed Translation
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC SN74AVC8T245-Q1 UNIT
RHL (VQFN) PW (TSSOP)
24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance

36.8

93.1

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.5

36.7

 °C/W
RθJB Junction-to-board thermal resistance

15.7

48.4

 °C/W
ψJT Junction-to-top characterization parameter 0.7

93.1

 °C/W
ψJB Junction-to-board characterization parameter 15.6

48.0

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.6

N/A

 °C/W