JAJSS10K December   2003  – November 2023 SN74AVC8T245

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.2 V
    7. 5.7  Switching Characteristics, VCCA = 1.5 V ± 0.1 V
    8. 5.8  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    9. 5.9  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    10. 5.10 Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Total Static Power Consumption (ICCA + ICCB)
    13. 5.13 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Fully Configurable Dual-Rail Design
      2. 6.3.2 Support High-Speed Translation
      3. 6.3.3 Ioff Supports Partial-Power-Down Mode Operation
      4. 6.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 6.3.5 Vcc Isolation
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DGV|24
  • RHL|24
  • PW|24
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1)SN74AVC8T245UNIT
DGVPWRHL
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance116.793.136.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance

48.5

36.732.5°C/W
RθJBJunction-to-board thermal resistance62.148.415.7°C/W
ψJTJunction-to-top characterization parameter7.093.10.7°C/W
ψJBJunction-to-board characterization parameter

61.6

48.015.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A5.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.