6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC |
Supply voltage |
–0.5 |
4.6 |
V |
VIN |
Control input voltage(2)(3) |
–0.5 |
7 |
V |
VI/O |
Switch I/O voltage(2)(3)(4) |
–0.5 |
7 |
V |
II/K |
Control input clamp current |
VIN < 0 |
|
–50 |
mA |
II/OK |
I/O port clamp current |
VI/O < 0 |
|
–50 |
mA |
IIO |
ON-state switch current(5) |
|
±64 |
mA |
|
Continuous current through VCC or GND |
|
±100 |
mA |
TJ |
Junction temperature |
|
150 |
°C |
Tstg |
Storage temperature |
–65 |
150 |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
+2000 |
V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) |
+1000 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
VCC |
Supply voltage |
2.3 |
3.6 |
V |
VIH |
High-level control input voltage |
VCC = 2.3 V to 2.7 V |
1.7 |
5.5 |
V |
VCC = 2.7 V to 3.6 V |
2 |
5.5 |
VIL |
Low-level control input voltage |
VCC = 2.3 V to 2.7 V |
0 |
0.7 |
V |
VCC = 2.7 V to 3.6 V |
0 |
0.8 |
VI/O |
Data input and output voltage |
0 |
5.5 |
V |
TA |
Operating free-air temperature |
–40 |
85 |
°C |
(1) All unused control inputs of the device must be held at V
CC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (
SCBA004).
6.4 Thermal Information
THERMAL METRIC(1) |
SN74CB3Q3257 |
UNIT |
DBQ (SSOP) |
DGV (TVSOP) |
PW (TSSOP) |
RGY (VQFN) |
16 PINS |
14 PINS |
14 PINS |
14 PINS |
RθJA |
Junction-to-ambient thermal resistance |
90 |
127 |
113 |
47 |
°C/W |
(1) For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report,
SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)(1)
PARAMETER |
TEST CONDITIONS |
MIN |
TYP(2) |
MAX |
UNIT |
VIK |
VCC = 3.6 V, |
II = –18 mA |
|
|
–1.8 |
V |
IIN |
Control inputs |
VCC = 3.6 V, |
VIN = 0 to 5.5 V |
|
|
±1 |
µA |
IOZ(3) |
VCC = 3.6 V, |
VO = 0 to 5.5 V, VI = 0, |
Switch OFF, VIN = VCC or GND |
|
|
±1 |
µA |
Ioff |
VCC = 0, |
VO = 0 to 5.5 V, |
VI = 0 |
|
|
1 |
µA |
ICC |
VCC = 3.6 V, |
II/O = 0, Switch ON or OFF, |
VIN = VCC or GND |
|
0.3 |
1 |
mA |
ΔICC(4) |
Control inputs |
VCC = 3.6 V, |
One input at 3 V, |
Other inputs at VCC or GND |
|
|
30 |
µA |
ICCD(5) |
Per control input |
VCC = 3.6 V, |
A and B ports open, |
|
0.04 |
0.2 |
mA/ MHz |
Control input switching at 50% duty cycle |
Cin |
Control inputs |
VCC = 3.3 V, |
VIN = 5.5 V, 3.3 V, or 0 |
|
2.5 |
3.5 |
pF |
Cio(OFF) |
VCC = 3.3 V, |
Switch OFF, VIN = VCC or GND, |
VI/O = 5.5 V, 3.3 V, or 0 |
|
4 |
5 |
pF |
Cio(ON) |
VCC = 3.3 V, |
Switch ON, VIN = VCC or GND, |
VI/O = 5.5 V, 3.3 V, or 0 |
|
8 |
10 |
pF |
ron(6) |
VCC = 2.3 V, TYP at VCC = 2.5 V |
VI = 0, |
IO = 30 mA |
|
4 |
8 |
Ω |
VI = 1.7 V, |
IO = –15 mA |
|
4 |
9 |
VCC = 3 V |
VI = 0, |
IO = 30 mA |
|
4 |
6 |
VI = 2.4 V, |
IO = –15 mA |
|
4 |
8 |
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see
Figure 2).
(6) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.
6.6 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER |
FROM (INPUT) |
TO (OUTPUT) |
VCC = 2.5 V ± 0.2 V |
VCC = 3.3 V ± 0.3 V |
UNIT |
MIN |
MAX |
MIN |
MAX |
fOE(1) |
OE |
A or B |
|
10 |
|
20 |
MHz |
tpd(2) |
A or B |
B or A |
|
0.12 |
|
0.2 |
ns |
ten |
OE |
A or B |
1.5 |
6.7 |
1.5 |
6.6 |
ns |
tdis |
OE |
A or B |
1 |
4.6 |
1 |
5.3 |
ns |
(1) Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
6.7 Typical Characteristics
At TA = 25°C and VCC = 3.3 V, unless otherwise noted.
Figure 1. Typical On-State Resistance vs Input Voltage
Figure 2. Typical Supply Current vs OE Switching Frequency