JAJSN63G December 1982 – October 2021 SN54HC138 , SN74HC138
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
THERMAL METRIC(1) | SN74HC138 | UNIT | |||||
---|---|---|---|---|---|---|---|
D (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | |||
16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 87.3 | 104.3 | 54.8 | 91.1 | 141.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 45.8 | 54.7 | 42.1 | 49.5 | 49.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 44.8 | 54.9 | 34.8 | 51.5 | 59.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 14.2 | 17.7 | 27 | 17.8 | 6.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 44.5 | 54.4 | 34.7 | 51.2 | 59.1 | °C/W |