JAJSPX5K May   2000  – March 2023 SN74LV06A

PRODMIX  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Noise Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|14
  • PW|14
  • DB|14
  • DGV|14
  • NS|14
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)SN74LV06AUNIT
DDBDGVNSPW
14 PINS14 PINS14 PINS14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance100.6112.5135.295.4128.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.865.057.952.957.2
RθJBJunction-to-board thermal resistance54.959.968.351.270.7
ψJTJunction-to-top characterization parameter25.025.09.217.99.3
ψJBJunction-to-board characterization parameter54.759.367.653.870.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).