JAJSOV2R April   1998  – March 2023 SN74LV165A

PRODMIX  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics,VCC = 5 V ± 0.5 V
    12. 6.12 Timing Diagrams
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Latching Logic
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)SN74LV165AUNIT

D

(SOIC)

DB

(SSOP)

NS

(SO)

PW

(TSSOP)

DGV

(TVSOP)

RGY

(VQFN)

BQB

(WQFN)

16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance86.2102.889.4113.3125.948.8

85.9

°C/W
RθJC(top)Junction-to-case (top) thermal resistance46.153.347.948.35146.7

82.4

°C/W
RθJBJunction-to-board thermal resistance43.853.549.858.457.724.9

55.6

°C/W
ψJTJunction-to-top characterization parameter13.216.616.66.45.72

9.4

°C/W
ψJBJunction-to-board characterization parameter43.552.949.557.857.224.9

55.6

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/A11.7

33.3

°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics