JAJSPY7J may   1998  – march 2023 SN74LV540A

PRODMIX  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 2.5 V ± 0.2 V
    7. 6.7  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 6.8  Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 6.9  Noise Characteristics
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Links
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DGV|20
  • DB|20
  • NS|20
  • PW|20
  • DW|20
  • RGY|20
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)SN74LV540AUNIT
DBDGVDWNSPWRGY
20 PINS
RθJAJunction-to-ambient thermal resistance96.0116.179.877.1128.235.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance57.731.345.843.670.543.3
RθJBJunction-to-board thermal resistance51.257.647.444.679.312.9
ψJTJunction-to-top characterization parameter19.41.018.517.223.40.9
ψJBJunction-to-board characterization parameter50.856.947.044.278.912.9
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/A7.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).