SCES464G June   2003  – August 2015 SN74LVC1G19

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, CL = 15 pF
    7. 6.7 Switching Characteristics, CL = 30 pF or 50 pF
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBV|6
  • DRL|6
  • YZP|6
  • DCK|6
  • DRY|6
サーマルパッド・メカニカル・データ
発注情報

8 Detailed Description

8.1 Overview

This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G19 device is a 1-of-2 decoder/demultiplexer. This device decodes the 1-bit address on input A and places a logic low on the matching address output, Y0 or Y1 , when the enable (E) input signal is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

8.2 Functional Block Diagram

SN74LVC1G19 ld_ces464.gif

8.3 Feature Description

SN74LVC1G19 is available in NanoFree package. NanoFree is a major breakthrough in IC packaging concepts, it is a bare die package developed for applications that require the smallest possible package. The device supports 5-V VCC Operation. All Inputs accept voltages up to 5.5 V. ±24-mA output drive at 3.3 V. The maximum time propagation delay (tpd ) is 5.4 ns at 3.3 V. Low Power Consumption, 10-μA Max ICC. Typical output ground bounce (VOLP ) and Output VOH Undershoot (VOHV). This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The SN74LVC1G19 device has isolation during power off. Ioff supports live insertion, partial-power-down mode and back drive protection.

8.4 Device Functional Modes

Table 1 lists the functional modes of the SN74LVC1G19.

Table 1. Function Table

INPUTS OUTPUTS
E A Y0 Y1
L L L H
L H H L
H X H H