SN74LVC2G04 Dual Inverter Gate

1 Features

• Available in the Texas Instruments
  NanoFree™ Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.1 ns at 3.3 V
• Low Power Consumption, 10-μA Max I_CC
• ±24-mA Output Drive at 3.3 V
• Typical V_OLP (Output Ground Bounce)
  <0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
  >2 V at V_CC = 3.3 V, T_A = 25°C
• I_off Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

2 Applications

• IP Phones: Wired and Wireless
• Optical Modules
• Optical Networking: EPON and Video Over Fiber
• Point-to-Point Microwave Backhaul
• Power: Telecom DC/DC Module: Analog and Digital
• Private Branch Exchanges (PBX)
• TETRA Base Exchanges
• Telecom Base Band Units
• Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted Amplifiers (TMA)
• Vector Signal Analyzers and Generators
• Video Converencing: IP-Based HD
• WiMAX and Wireless Infrastructure Equipment
• Wireless Communications Testers and Wireless Repeaters
• xDSL Modems and DSLAM

3 Description

This dual inverter is designed for 1.65-V to 5.5-V V_CC operation. The SN74LVC2G04 device performs the Boolean function Y = A.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

1. For all available packages, see the orderable addendum at the end of the datasheet.

Logic Diagram (Positive Logic)

4 Revision History

Changes from M Revision (November 2013) to N Revision

• Removed the Ordering Information table, added the Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from L Revision (January 2007) to M Revision

• Updated document to new TI data sheet format.Go
• Added ESD warning Go
• Updated operating temperature range.Go

5 Pin Configuration and Functions

DBV Package

6-Pin SOT-23

Top View

DCK Package

6-Pin SC70

Top View

DRL Package

6-Pin SOT

Top View

YZP Package

6-Pin DSBGA

Bottom View