JAJSPH6A september   2010  – december 2022 SN74LVC8T245-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    7. 6.7  Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    8. 6.8  Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics, VCCA = 5 V ± 0.5 V
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.65-V to 5.5-V Power-Supply Range
      2. 8.3.2 Ioff Supports Partial-Power-Down Mode Operation
      3. 8.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 8.3.4 Vcc Isolation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC1PWUNIT
24 PINS
RθJAJunction-to-ambient thermal resistance100.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance44.7
RθJBJunction-to-board thermal resistance55.8°C/W
ψJTJunction-to-top characterization parameter6.8°C/W
ψJBJunction-to-board characterization parameter55.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W