JAJSPH0G May 2000 – February 2023 SN65LBC176A , SN75LBC176A
PRODUCTION DATA
| THERMAL METRIC(1) | All Devices in 'P' Package | SN65LBC176ADR SN65LBC176AQDR | OPNs Not Listed in Previous Column | UNIT | |
|---|---|---|---|---|---|
| P (PDIP) | D (SOIC) | D (SOIC) | |||
| 8-Pins | 8-Pins | 8-Pins | |||
| R θJA | Junction-to-ambient thermal resistance | 65.7 | 116.7 | 110 | °C/W |
| R θJC | Junction-to-case thermal resistance | 54.7 | 56.3 | 44.1 | °C/W |
| R θJB | Junction-to-board thermal resistance | 42.1 | 63.4 | 53.5 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 23 | 8.8 | 4.8 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 41.7 | 62.9 | 52.7 | °C/W |