JAJSPH2 データシート

JAJSPH2E May 2000 – January 2023 SN65LBC180A , SN75LBC180A

PRODUCTION DATA

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		N (PDIP)	D (SOIC) SN75 Devices	D (SOIC) SN65 Devices	UNIT
THERMAL METRIC⁽¹⁾		14-Pins	14-Pins	14-Pins	UNIT
R _θJA	Junction-to-ambient thermal resistance	54.2	88.6	93.2	°C/W
R _θJB	Junction-to-board thermal resistance	41.6	49.12	49.4	°C/W
ψ _JT	Junction-to-top characterization parameter	34.0	14.17	11.2	°C/W
ψ _JB	Junction-to-board characterization parameter	21.1	48.6	48.9	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.