SLASF36A January   2024  – December 2024 TAC5311-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Charactaristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configuration
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Microphone Bias
      6. 6.3.6  Digital PDM Microphone Record Channel
      7. 6.3.7  Signal-Chain Processing
        1. 6.3.7.1 ADC Signal-Chain
          1. 6.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.1.2 Programmable Channel Gain Calibration
          3. 6.3.7.1.3 Programmable Channel Phase Calibration
          4. 6.3.7.1.4 Programmable Digital High-Pass Filter
          5. 6.3.7.1.5 Programmable Digital Biquad Filters
          6. 6.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 6.3.7.1.7 Configurable Digital Decimation Filters
            1. 6.3.7.1.7.1 Linear-phase filters
              1. 6.3.7.1.7.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.1.7.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.1.7.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.1.7.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.1.7.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.1.7.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.1.7.1.7 Sampling Rate: 192kHz or 176.4kHz
              8. 6.3.7.1.7.1.8 Sampling Rate: 384kHz or 352.8kHz
              9. 6.3.7.1.7.1.9 Sampling Rate: 768kHz or 705.6kHz
            2. 6.3.7.1.7.2 Low-latency Filters
              1. 6.3.7.1.7.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.1.7.3 Ultra-Low-Latency Filters
              1. 6.3.7.1.7.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.3.5 Sampling Rate: 192kHz or 176.4kHz
        2. 6.3.7.2 DAC Signal-Chain
          1. 6.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.2.2 Programmable Channel Gain Calibration
          3. 6.3.7.2.3 Programmable Digital High-Pass Filter
          4. 6.3.7.2.4 Programmable Digital Biquad Filters
          5. 6.3.7.2.5 Programmable Digital Mixer
          6. 6.3.7.2.6 Configurable Digital Interpolation Filters
            1. 6.3.7.2.6.1 Linear-phase filters
              1. 6.3.7.2.6.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.2.6.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.2.6.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.2.6.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.2.6.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.2.6.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.2.6.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.7.2.6.2 Low-latency Filters
              1. 6.3.7.2.6.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.2.6.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.2.6.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.2.6.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.2.6.2.5 Sampling Rate: 192kHz or 176.4kHz
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Input DC Fault Diagnostics
      10. 6.3.10 Power Tune Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Software Reset
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAC5311-Q1_B0_P0 Registers
      2. 7.1.2 TAC5311-Q1_B0_P1 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1  Programmable Coefficient Registers: Page 8
      2. 7.2.2  Programmable Coefficient Registers: Page 9
        1. 7.2.2.1 TAC5311-Q1_B0_P3 Registers
      3. 7.2.3  Programmable Coefficient Registers: Page 10
      4. 7.2.4  Programmable Coefficient Registers: Page 11
      5. 7.2.5  Programmable Coefficient Registers: Page 15
      6. 7.2.6  Programmable Coefficient Registers: Page 16
      7. 7.2.7  Programmable Coefficient Registers: Page 17
      8. 7.2.8  Programmable Coefficient Registers: Page 18
      9. 7.2.9  Programmable Coefficient Registers: Page 19
      10. 7.2.10 Programmable Coefficient Registers: Page 25
      11. 7.2.11 Programmable Coefficient Registers: Page 26
      12. 7.2.12 Programmable Coefficient Registers: Page 27
      13. 7.2.13 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Pin Configuration and Functions

TAC5311-Q1 TAC5311-Q1 RTV Package,32-Pin WQFN With Exposed Thermal Pad,Top View Figure 4-1 TAC5311-Q1 RTV Package,32-Pin WQFN With Exposed Thermal Pad,Top View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
VSS 1 Ground Ground pin. Short directly to board ground plane.
DREG 2 Digital Supply Digital on-chip regulator output voltage for digital supply (1.5V, nominal)
BCLK 3 Digital I/O Audio serial data interface bus bit clock
FSYNC 4 Digital I/O Audio serial data interface bus frame synchronization signal
DOUT 5 Digital Output Audio serial data interface bus output
DIN 6 Digital Input Audio serial data interface bus input
IOVDD 7 Digital Supply Digital I/O power supply (1.2V, 1.8V or 3.3V, nominal)
IOVSS 8 Ground Ground pin for digital I/O power supply. Short directly to board ground plane.
SCL 9 Digital Input Clock for I2C control interface
SDA 10 Digital I/O Data for I2C control interface
GPIO1 11 Digital I/O General-purpose digital input/output 1 (multipurpose functions such as daisy-chain input, audio data output, PLL input clock source, interrupt, and so forth)
VBATIN 12 Analog Analog VBAT input monitoring pin (used for input diagnostics)
BSTVDD 13 Analog Supply Boost converter supply voltage (3.3V, nominal)
BSTSW 14 Analog Supply Boost converter switching pin
BSTVSS 15 Ground Ground pin for boost converter supply. Short directly to board ground plane.
BSTOUT 16 Analog Supply Boost convertor output voltage
MICBIAS 17 Analog Microphone bias output (Porgrammable output upto 10V)
IN1P 18 Analog Input Analog input 1P pin
IN1M 19 Analog Input Analog input 1M pin
IN2P 20 Analog Input Analog input 2P pin (when using ADC channel swap options) or Diagnostic pin for input 1P in AC-coupled mode
IN2M 21 Analog Input Analog input 2M pin (when using ADC channel swap options) or Diagnostic pin for input 1M in AC-coupled mode
ADDRA 22 Digital Input I2C address pin
GPO1A 23 Digital Output General-purpose digital output 1A (multipurpose functions such as audio data output, interrupt, and so forth)
GPI2A 24 Digital Input General-purpose digital input 2A (multipurpose functions such as daisy-chain input, PLL input clock source, and so forth)
GPI1A 25 Digital Input General-purpose digital input 1A (multipurpose functions such as daisy-chain input, PLL input clock source, and so forth)
AVSS 26 Ground Groung pin for analog power supply. Short directly to board ground plane.
OUT1M 27 Analog Output Analog output 1M pin
OUT1P 28 Analog Output Analog output 1P pin
OUT2P 29 Analog Output Analog output 2P pin (When using DAC channel swap option)
OUT2M 30 Analog Output Analog output 2M pin (When using DAC channel swap option)
AVDD 31 Analog Supply Analog power supply (3.3V, nominal)
VREF 32 Analog Analog reference voltage filter output
VSS Thermal Pad Ground Thermal pad shorted to internal device ground. Short directly to board ground plane.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.