SLASF33 January   2024 TAC5412-Q1

ADVANCE INFORMATION  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1  Absolute Maximum Ratings
   2. 5.2  ESD Ratings
   3. 5.3  Recommended Operating Conditions
   4. 5.4  Thermal Information
   5. 5.5  Thermal Information
   6. 5.6  Electrical Characteristics
   7. 5.7  Timing Requirements: I2C Interface
   8. 5.8  Switching Characteristics: I2C Interface
   9. 5.9  Timing Requirements: SPI Interface
   10. 5.10 Switching Characteristics: SPI Interface
   11. 5.11 Timing Requirements: TDM, I2S or LJ Interface
   12. 5.12 Switching Characteristics: TDM, I2S or LJ Interface
   13. 5.13 Timing Requirements: PDM Digital Microphone Interface
   14. 5.14 Switching Characteristics: PDM Digial Microphone Interface
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
         1. 6.3.1.1 Control Serial Interfaces
         2. 6.3.1.2 Audio Serial Interfaces
            1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
            2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
            3. 6.3.1.2.3 Left-Justified (LJ) Interface
      2. 6.3.2  Using Multiple Devices With Shared Buses
      3. 6.3.3  Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4  Input Channel Configuration
      5. 6.3.5  Reference Voltage
      6. 6.3.6  Microphone Bias
      7. 6.3.7  Input DC Fault Diagnostics
         1. 6.3.7.1 Fault Conditions
            1. 6.3.7.1.1 Input Pin Short to Ground
            2. 6.3.7.1.2 Input Pin Short to MICBIAS
            3. 6.3.7.1.3 Open Inputs
            4. 6.3.7.1.4 Short Between INxP and INxM
            5. 6.3.7.1.5 Input Pin Overvoltage
            6. 6.3.7.1.6 Input Pin Short to VBAT_IN
         2. 6.3.7.2 Fault Reporting
            1. 6.3.7.2.1 Overcurrent and Overtemperature Protection
      8. 6.3.8  Signal-Chain Processing
         1. 6.3.8.1 ADC Signal-Chain
            1. 6.3.8.1.1 Programmable Channel Gain and Digital Volume Control
            2. 6.3.8.1.2 Programmable Channel Gain Calibration
            3. 6.3.8.1.3 Programmable Channel Phase Calibration
            4. 6.3.8.1.4 Programmable Digital High-Pass Filter
            5. 6.3.8.1.5 Programmable Digital Biquad Filters
            6. 6.3.8.1.6 Programmable Channel Summer and Digital Mixer
            7. 6.3.8.1.7 Configurable Digital Decimation Filters
               1. 6.3.8.1.7.1 Linear Phase Filters
                  1. 6.3.8.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
                  2. 6.3.8.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
                  3. 6.3.8.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
                  4. 6.3.8.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
                  5. 6.3.8.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
                  6. 6.3.8.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
      9. 6.3.9  DAC Signal-Chain
         1. 6.3.9.1 Programmable Channel Gain and Digital Volume Control
         2. 6.3.9.2 Programmable Channel Gain Calibration
         3. 6.3.9.3 Programmable Digital High-Pass Filter
         4. 6.3.9.4 Programmable Digital Biquad Filters
         5. 6.3.9.5 Programmable Digital Mixer
         6. 6.3.9.6 Configurable Digital Interpolation Filters
            1. 6.3.9.6.1 Linear Phase Filters
               1. 6.3.9.6.1.1 Sampling Rate: 16kHz or 14.7kHz
               2. 6.3.9.6.1.2 Sampling Rate: 24kHz or 22.05kHz
               3. 6.3.9.6.1.3 Sampling Rate: 32kHz or 29.4kHz
               4. 6.3.9.6.1.4 Sampling Rate: 48kHz or 44.1kHz
               5. 6.3.9.6.1.5 Sampling Rate: 96kHz or 88.2kHz
               6. 6.3.9.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
8. 7 Register Maps
   1. 7.1 Page 0 Registers
   2. 7.2 Page 1 Registers
   3. 7.3 Page_3 Registers
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
10. 9 Power Supply Recommendations
11. 10Device and Documentation Support
    1. 10.1 Documentation Support
       1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information