JAJSHH5 May 2019 TAS5806MD
PRODUCTION DATA.
THERMAL METRIC(1) | TAS5806MD
TSSOP (DCP) 38 PINS |
UNIT | |||
---|---|---|---|---|---|
JEDEC
STANDARD 2-LAYER PCB |
JEDEC
STANDARD 4-LAYER PCB |
TAS5806MDEVM-4
4-LAYER PCB |
|||
RθJA | Junction-to-ambient thermal resistance | - | 29.2 | 23.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | - | 18 | - | °C/W |
RθJB | Junction-to-board thermal resistance | - | 9.6 | - | °C/W |
ψJT | Junction-to-top characterization parameter | - | 0.8 | 1.5 | °C/W |
ψJB | Junction-to-board characterization parameter | - | 9.5 | 8.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | 2.4 | - | °C/W |