JAJSHH5 May 2019 TAS5806MD
PRODUCTION DATA.
The PCB footprint (also known as a symbol or land pattern) communicates to the PCB fabrication vendor the shape and position of the copper patterns to which the TAS5806MD device will be soldered. This footprint can be followed directly from the guidance in the package addendum at the end of this data sheet. It is important to make sure that the thermal pad, which connects electrically and thermally to the PowerPAD™ of the TAS5806MD device, be made no smaller than what is specified in the package addendum. This ensures that the TAS5806MD device has the largest interface possible to move heat from the device to the board.
The via pattern shown in the package addendum provides an improved interface to carry the heat from the device through to the layers of the PCB, because small diameter plated vias (with minimally-sized annular rings) present a low thermal-impedance path from the device into the PCB. Once into the PCB, the heat travels away from the device and into the surrounding structures and air. By increasing the number of vias, as shown in the Layout Example section, this interface can benefit from improved thermal performance.
NOTE
Vias can obstruct heat flow if they are not constructed properly.
More notes on the construction and placement of vias are as follows: