JAJSKP7 December   2020 TAS5822M

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
    1.     Device Comparison Table
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation, Fsw = 768kHz
      2. 6.7.2 Parallel Bridge Tied Load (PBTL) Configuration Curves with 1SPW Modulation, Fsw = 768kHz
    8. 6.8 Parametric Measurement Information
      1. 6.8.1 Power Consumption Summary
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
      2. 7.3.2 Device Clocking
      3. 7.3.3 Serial Audio Port – Clock Rates
      4. 7.3.4 Clock Halt Auto-recovery
      5. 7.3.5 Sample Rate on the Fly Change
      6. 7.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 7.3.7 Digital Audio Processing
      8. 7.3.8 Class D Audio Amplifier
        1. 7.3.8.1 Speaker Amplifier Gain Select
    4. 7.4 Device Functional Modes
      1. 7.4.1 Software Control
      2. 7.4.2 Speaker Amplifier Operating Modes
        1. 7.4.2.1 BTL Mode
        2. 7.4.2.2 PBTL Mode
      3. 7.4.3 Minimize EMI with Spread Spectrum
      4. 7.4.4 Minimize EMI with channel to channel phase shift
      5. 7.4.5 Minimize EMI with Multi-Devices PWM Phase Synchronization
      6. 7.4.6 Thermal Foldback
      7. 7.4.7 Device State Control
      8. 7.4.8 Device Modulation
        1. 7.4.8.1 BD Modulation
        2. 7.4.8.2 1SPW Modulation
        3. 7.4.8.3 Hybrid Modulation
    5. 7.5 Programming and Control
      1. 7.5.1 I2 C Serial Communication Bus
      2. 7.5.2 Slave Address
        1. 7.5.2.1 Random Write
        2. 7.5.2.2 Sequential Write
        3. 7.5.2.3 Random Read
        4. 7.5.2.4 Sequential Read
        5. 7.5.2.5 DSP Memory Book, Page and BQ update
        6. 7.5.2.6 Example Use
        7. 7.5.2.7 Checksum
          1. 7.5.2.7.1 Cyclic Redundancy Check (CRC) Checksum
          2. 7.5.2.7.2 Exclusive or (XOR) Checksum
      3. 7.5.3 Control via Software
        1. 7.5.3.1 Startup Procedures
        2. 7.5.3.2 Shutdown Procedures
        3. 7.5.3.3 Protection and Monitoring
          1. 7.5.3.3.1 Over current Shutdown (OCSD)
          2. 7.5.3.3.2 Speaker DC Protection
          3. 7.5.3.3.3 Device Over Temperature Protection
          4. 7.5.3.3.4 Over Voltage Protection
          5. 7.5.3.3.5 Under Voltage Protection
          6. 7.5.3.3.6 Clock Fault
    6. 7.6 Register Maps
      1. 7.6.1 CONTROL PORT Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 2.0 (Stereo BTL) System
      2. 8.2.2 MONO （PBTL) System
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Bootstrap Capacitors
          2. 8.2.2.2.2 Inductor Selections
          3. 8.2.2.2.3 Power Supply Decoupling
          4. 8.2.2.2.4 Output EMI Filtering
        3. 8.2.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 DVDD Supply
    2. 9.2 PVDD Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General Guidelines for Audio Amplifiers
      2. 10.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 10.1.3 Optimizing Thermal Performance
        1. 10.1.3.1 Device, Copper, and Component Layout
        2. 10.1.3.2 Stencil Pattern
          1. 10.1.3.2.1 PCB footprint and Via Arrangement
          2. 10.1.3.2.2 Solder Stencil
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 サポート・リソース
    2. 11.2 Trademarks
    3. 11.3 静電気放電に関する注意事項
    4. 11.4 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1.3 Optimizing Thermal Performance

Follow the layout example shown in the Figure 10-1 to achieve the best balance of solution size, thermal, audio, and electromagnetic performance. In some cases, deviation from this guidance can be required due to design constraints which cannot be avoided. In these instances, the system designer should ensure that the heat can get out of the device and into the ambient air surrounding the device. Fortunately, the heat created in the device naturally travels away from the device and into the lower temperature structures around the device.