Primarily, the goal of the PCB design is to
minimize the thermal impedance in the path to those cooler structures. These tips
must be followed to achieve that goal:
- Avoid placing other heat producing components or structures
near the amplifier (including above or below in the end equipment).
- If possible, use a higher layer count PCB to provide more
heat sinking capability for the TAS5827 device and to prevent
traces and copper signal and power planes from breaking up the contiguous
copper on the top and bottom layer.
- Place the TAS5827 device away from the edge
of the PCB when possible to make sure that the heat can travel away from the
device on all four sides.
- Avoid cutting off the flow of heat from the TAS5827 device to the surrounding areas with traces or via
strings. Instead, route traces perpendicular to the device and line up vias
in columns which are perpendicular to the device.
- Unless the area between two pads of a passive component is
large enough to allow copper to flow in between the two pads, orient the
pads so that the narrow end of the passive component is facing the TAS5827 device.
- Because the ground pins are the best conductors of heat in
the package, maintain a contiguous ground plane from the ground pins to the
PCB area surrounding the device for as many of the ground pins as
possible.