JAJSM14B June   2021  – October 2023 TCA39306-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics (Translating Down)
    7. 5.7 Switching Characteristics (Translating Up)
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Definition of threshold voltage
      2. 7.1.2 Correct Device Set Up
      3. 7.1.3 Disconnecting a Target from the Main Bus Using the EN Pin
      4. 7.1.4 Supporting Remote Board Insertion to Backplane with TCA39306-Q1
      5. 7.1.5 Switch Configuration
      6. 7.1.6 Controller on Side 1 or Side 2 of Device
      7. 7.1.7 LDO and TCA39306-Q1 Concerns
      8. 7.1.8 Current Limiting Resistance on VREF2
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN) Pin
      2. 7.3.2 Voltage Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Applications of I2C
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bidirectional Voltage Translation
        2. 8.2.2.2 Sizing Pullup Resistors
        3. 8.2.2.3 Bandwidth
      3. 8.2.3 Application Curve
    3. 8.3 Systems Examples: I3C Usage Considerations
      1. 8.3.1 I3C Bus Switching
      2. 8.3.2 I3C Bus Voltage Translation
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TCA39306-Q1 UNIT
DCU
8 PINS
RθJA Junction-to-ambient thermal resistance 275.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 127.1 °C/W
RθJB Junction-to-board thermal resistance 186.9 °C/W
ΨJT Junction-to-top characterization parameter 65.7 °C/W
ΨJB Junction-to-board characterization parameter 185.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.