SPRS969G August 2016 – November 2019 TDA2EG-17
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
Table 5-14 provides the thermal resistance characteristics for the package used on this device.
NOTE
Power dissipation of 3.0 W and an ambient temperature of 85ºC is assumed for CBD package.
NO. | PARAMETER | DESCRIPTION | °C/W(1) | AIR FLOW (m/s)(2) |
---|---|---|---|---|
T1 | RΘJC | Junction-to-case | 0.23 | N/A |
T2 | RΘJB | Junction-to-board | 3.65 | N/A |
T3 | RΘJA | Junction-to-free air | 12.8 | 0 |
T4 | Junction-to-moving air | 10.4 | 0.5 | |
T5 | 9.6 | 1 | ||
T6 | 8.8 | 2 | ||
T7 | 8.3 | 3 | ||
T8 | ΨJT | Junction-to-package top | 0.1 | 0 |
T9 | 0.1 | 0.5 | ||
T10 | 0.1 | 1 | ||
T11 | 0.1 | 2 | ||
T12 | 0.1 | 3 | ||
T13 | ΨJB | Junction-to-board | 3.7 | 0 |
T14 | 3.7 | 0.5 | ||
T15 | 3.6 | 1 | ||
T16 | 3.6 | 2 | ||
T17 | 3.5 | 3 |