JAJSGK9F December   2015  – May 2019 TDA2HF , TDA2HG , TDA2HV , TDA2LF , TDA2SA , TDA2SG , TDA2SX

PRODUCTION DATA.  

  1. 1 デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2 改訂履歴
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Port (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  External Memory Interface (EMIF)
      5. 4.4.5  General-Purpose Memory Controller (GPMC)
      6. 4.4.6  Timers
      7. 4.4.7  Inter-Integrated Circuit Interface (I2C)
      8. 4.4.8  Universal Asynchronous Receiver Transmitter (UART)
      9. 4.4.9  Multichannel Serial Peripheral Interface (McSPI)
      10. 4.4.10 Quad Serial Peripheral Interface (QSPI)
      11. 4.4.11 Multichannel Audio Serial Port (McASP)
      12. 4.4.12 Universal Serial Bus (USB)
      13. 4.4.13 SATA
      14. 4.4.14 Peripheral Component Interconnect Express (PCIe)
      15. 4.4.15 Controller Area Network Interface (DCAN)
      16. 4.4.16 Ethernet Interface (GMAC_SW)
      17. 4.4.17 eMMC/SD/SDIO
      18. 4.4.18 General-Purpose Interface (GPIO)
      19. 4.4.19 Pulse Width Modulation (PWM) Interface
      20. 4.4.20 System and Miscellaneous
        1. 4.4.20.1 Sysboot Interface
        2. 4.4.20.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.20.3 Real Time Clock (RTC) Interface
        4. 4.4.20.4 System Direct Memory Access (SDMA)
        5. 4.4.20.5 Interrupt Controllers (INTC)
        6. 4.4.20.6 Observability
        7. 4.4.20.7 Power Supplies
      21. 4.4.21 Test Interfaces
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hour (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS OSC Buffers DC Electrical Characteristics
      7. 5.7.7  BC1833IHHV Buffers DC Electrical Characteristics
      8. 5.7.8  USBPHY DC Electrical Characteristics
      9. 5.7.9  Dual Voltage SDIO1833 DC Electrical Characteristics
      10. 5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
      11. 5.7.11 SATAPHY DC Electrical Characteristics
      12. 5.7.12 PCIEPHY DC Electrical Characteristics
    8. 5.8 Thermal Resistance Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. 6 Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
    2. 6.2 RC On-die Oscillator Clock
    3. 6.3 DPLLs, DLLs Specifications
      1. 6.3.1 DPLL Characteristics
      2. 6.3.2 DLL Characteristics
      3. 6.3.3 DPLL and DLL Noise Isolation
  7. 7 Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem – Video Output Ports
    8. 7.8  Display Subsystem – High-Definition Multimedia Interface (HDMI)
    9. 7.9  External Memory Interface (EMIF)
    10. 7.10 General-Purpose Memory Controller (GPMC)
      1. 7.10.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.10.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.10.3 GPMC/NAND Flash Interface Asynchronous Timing
    11. 7.11 Timers
    12. 7.12 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-34 Timing Requirements for I2C Input Timings
      2. Table 7-35 Timing Requirements for I2C HS-Mode (I2C3/4/5 Only)
      3. Table 7-36 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    13. 7.13 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-37 Timing Requirements for UART
      2. Table 7-38 Switching Characteristics Over Recommended Operating Conditions for UART
    14. 7.14 Multichannel Serial Peripheral Interface (McSPI)
    15. 7.15 Quad Serial Peripheral Interface (QSPI)
    16. 7.16 Multichannel Audio Serial Port (McASP)
      1. Table 7-45 Timing Requirements for McASP1
      2. Table 7-46 Timing Requirements for McASP2
      3. Table 7-47 Timing Requirements for McASP3/4/5/6/7/8
      4. Table 7-48 Switching Characteristics Over Recommended Operating Conditions for McASP1
      5. Table 7-49 Switching Characteristics Over Recommended Operating Conditions for McASP2
      6. Table 7-50 Switching Characteristics Over Recommended Operating Conditions for McASP3/4/5/6/7/8
    17. 7.17 Universal Serial Bus (USB)
      1. 7.17.1 USB1 DRD PHY
      2. 7.17.2 USB2 PHY
      3. 7.17.3 USB3 and USB4 DRD ULPI—SDR—Slave Mode—12-pin Mode
    18. 7.18 Serial Advanced Technology Attachment (SATA)
    19. 7.19 Peripheral Component Interconnect Express (PCIe)
    20. 7.20 Controller Area Network Interface (DCAN)
      1. Table 7-65 Timing Requirements for DCANx Receive
      2. Table 7-66 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    21. 7.21 Ethernet Interface (GMAC_SW)
      1. 7.21.1 GMAC MII Timings
        1. Table 7-67 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-68 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-69 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-70 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.21.2 GMAC MDIO Interface Timings
      3. 7.21.3 GMAC RMII Timings
        1. Table 7-75 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-76 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-77 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-78 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.21.4 GMAC RGMII Timings
        1. Table 7-82 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-83 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-84 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-85 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    22. 7.22 eMMC/SD/SDIO
      1. 7.22.1 MMC1—SD Card Interface
        1. 7.22.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.22.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.22.1.3 SDR12, 4-bit data, half-cycle
        4. 7.22.1.4 SDR25, 4-bit data, half-cycle
        5. 7.22.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.22.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.22.1.7 UHS-I DDR50, 4-bit data
      2. 7.22.2 MMC2 — eMMC
        1. 7.22.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.22.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.22.2.3 High-speed HS200 JC64 SDR, 8-bit data, half cycle
        4. 7.22.2.4 High-speed JC64 DDR, 8-bit data
      3. 7.22.3 MMC3 and MMC4—SDIO/SD
        1. 7.22.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.22.3.2 MMC3 and MMC4, SD High Speed
        3. 7.22.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.22.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.22.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    23. 7.23 General-Purpose Interface (GPIO)
    24. 7.24 System and Miscellaneous interfaces
    25. 7.25 Test Interfaces
      1. 7.25.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.25.1.1 JTAG Electrical Data/Timing
          1. Table 7-134 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-135 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-136 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-137 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.25.2 Trace Port Interface Unit (TPIU)
        1. 7.25.2.1 TPIU PLL DDR Mode
  8. 8 Applications, Implementation, and Layout
    1. 8.1 Introduction
      1. 8.1.1 Initial Requirements and Guidelines
    2. 8.2 Power Optimizations
      1. 8.2.1 Step 1: PCB Stack-up
      2. 8.2.2 Step 2: Physical Placement
      3. 8.2.3 Step 3: Static Analysis
        1. 8.2.3.1 PDN Resistance and IR Drop
      4. 8.2.4 Step 4: Frequency Analysis
      5. 8.2.5 System ESD Generic Guidelines
        1. 8.2.5.1 System ESD Generic PCB Guideline
        2. 8.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
      6. 8.2.6 EMI / EMC Issues Prevention
        1. 8.2.6.1 Signal Bandwidth
        2. 8.2.6.2 Signal Routing
          1. 8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 8.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 8.2.6.3 Ground Guidelines
          1. 8.2.6.3.1 PCB Outer Layers
          2. 8.2.6.3.2 Metallic Frames
          3. 8.2.6.3.3 Connectors
          4. 8.2.6.3.4 Guard Ring on PCB Edges
          5. 8.2.6.3.5 Analog and Digital Ground
    3. 8.3 Core Power Domains
      1. 8.3.1 General Constraints and Theory
      2. 8.3.2 Voltage Decoupling
      3. 8.3.3 Static PDN Analysis
      4. 8.3.4 Dynamic PDN Analysis
      5. 8.3.5 Power Supply Mapping
      6. 8.3.6 DPLL Voltage Requirement
      7. 8.3.7 Loss of Input Power Event
      8. 8.3.8 Example PCB Design
        1. 8.3.8.1 Example Stack-up
        2. 8.3.8.2 vdd_mpu Example Analysis
    4. 8.4 Single-Ended Interfaces
      1. 8.4.1 General Routing Guidelines
      2. 8.4.2 QSPI Board Design and Layout Guidelines
    5. 8.5 Differential Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 8.5.2.1 Background
        2. 8.5.2.2 USB PHY Layout Guide
          1. 8.5.2.2.1 General Routing and Placement
          2. 8.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 8.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 8.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 8.5.2.2.2.3  Board Stackup
            4. 8.5.2.2.2.4  Cable Connector Socket
            5. 8.5.2.2.2.5  Clock Routings
            6. 8.5.2.2.2.6  Crystals/Oscillator
            7. 8.5.2.2.2.7  DP/DM Trace
            8. 8.5.2.2.2.8  DP/DM Vias
            9. 8.5.2.2.2.9  Image Planes
            10. 8.5.2.2.2.10 JTAG Interface
            11. 8.5.2.2.2.11 Power Regulators
        3. 8.5.2.3 Electrostatic Discharge (ESD)
          1. 8.5.2.3.1 IEC ESD Stressing Test
            1. 8.5.2.3.1.1 Test Mode
            2. 8.5.2.3.1.2 Air Discharge Mode
            3. 8.5.2.3.1.3 Test Type
          2. 8.5.2.3.2 TI Component Level IEC ESD Test
          3. 8.5.2.3.3 Construction of a Custom USB Connector
          4. 8.5.2.3.4 ESD Protection System Design Consideration
        4. 8.5.2.4 References
      3. 8.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 8.5.3.1 USB 3.0 interface introduction
        2. 8.5.3.2 USB 3.0 General routing rules
      4. 8.5.4 HDMI Board Design and Layout Guidelines
        1. 8.5.4.1 HDMI Interface Schematic
        2. 8.5.4.2 TMDS General Routing Guidelines
        3. 8.5.4.3 TPD5S115
        4. 8.5.4.4 HDMI ESD Protection Device (Required)
        5. 8.5.4.5 PCB Stackup Specifications
        6. 8.5.4.6 Grounding
      5. 8.5.5 SATA Board Design and Layout Guidelines
        1. 8.5.5.1 SATA Interface Schematic
        2. 8.5.5.2 Compatible SATA Components and Modes
        3. 8.5.5.3 PCB Stackup Specifications
        4. 8.5.5.4 Routing Specifications
      6. 8.5.6 PCIe Board Design and Layout Guidelines
        1. 8.5.6.1 PCIe Connections and Interface Compliance
          1. 8.5.6.1.1 Coupling Capacitors
          2. 8.5.6.1.2 Polarity Inversion
        2. 8.5.6.2 Non-standard PCIe connections
          1. 8.5.6.2.1 PCB Stackup Specifications
          2. 8.5.6.2.2 Routing Specifications
            1. 8.5.6.2.2.1 Impedance
            2. 8.5.6.2.2.2 Differential Coupling
            3. 8.5.6.2.2.3 Pair Length Matching
        3. 8.5.6.3 LJCB_REFN/P Connections
    6. 8.6 Clock Routing Guidelines
      1. 8.6.1 32-kHz Oscillator Routing
      2. 8.6.2 Oscillator Ground Connection
    7. 8.7 DDR2/DDR3 Board Design and Layout Guidelines
      1. 8.7.1 DDR2/DDR3 General Board Layout Guidelines
      2. 8.7.2 DDR2 Board Design and Layout Guidelines
        1. 8.7.2.1 Board Designs
        2. 8.7.2.2 DDR2 Interface
          1. 8.7.2.2.1  DDR2 Interface Schematic
          2. 8.7.2.2.2  Compatible JEDEC DDR2 Devices
          3. 8.7.2.2.3  PCB Stackup
          4. 8.7.2.2.4  Placement
          5. 8.7.2.2.5  DDR2 Keepout Region
          6. 8.7.2.2.6  Bulk Bypass Capacitors
          7. 8.7.2.2.7  High-Speed Bypass Capacitors
          8. 8.7.2.2.8  Net Classes
          9. 8.7.2.2.9  DDR2 Signal Termination
          10. 8.7.2.2.10 VREF Routing
        3. 8.7.2.3 DDR2 CK and ADDR_CTRL Routing
      3. 8.7.3 DDR3 Board Design and Layout Guidelines
        1. 8.7.3.1  Board Designs
          1. 8.7.3.1.1 DDR3 versus DDR2
        2. 8.7.3.2  DDR3 EMIFs
        3. 8.7.3.3  DDR3 Device Combinations
        4. 8.7.3.4  DDR3 Interface Schematic
          1. 8.7.3.4.1 32-Bit DDR3 Interface
          2. 8.7.3.4.2 16-Bit DDR3 Interface
        5. 8.7.3.5  Compatible JEDEC DDR3 Devices
        6. 8.7.3.6  PCB Stackup
        7. 8.7.3.7  Placement
        8. 8.7.3.8  DDR3 Keepout Region
        9. 8.7.3.9  Bulk Bypass Capacitors
        10. 8.7.3.10 High-Speed Bypass Capacitors
          1. 8.7.3.10.1 Return Current Bypass Capacitors
        11. 8.7.3.11 Net Classes
        12. 8.7.3.12 DDR3 Signal Termination
        13. 8.7.3.13 VREF_DDR Routing
        14. 8.7.3.14 VTT
        15. 8.7.3.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.7.3.15.1 Four DDR3 Devices
            1. 8.7.3.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.7.3.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.7.3.15.2 Two DDR3 Devices
            1. 8.7.3.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.7.3.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.7.3.15.3 One DDR3 Device
            1. 8.7.3.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.7.3.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.7.3.16 Data Topologies and Routing Definition
          1. 8.7.3.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.7.3.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.7.3.17 Routing Specification
          1. 8.7.3.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.7.3.17.2 DQS and DQ Routing Specification
  9. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature and Orderable Information
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Related Links
    5. 9.5 Community Resources
    6. 9.6 商標
    7. 9.7 静電気放電に関する注意事項
    8. 9.8 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

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発注情報

7.5 Virtual and Manual I/O Timing Modes

Some of the timings described in the following sections require the use of Virtual or Manual I/O Timing Modes. Table 7-2 provides a summary of the Virtual and Manual I/O Timing Modes across all device interfaces. The individual interface timing sections found later in this document provide the full description of each applicable Virtual and Manual I/O Timing Mode. Refer to the "Pad Configuration" section of the TRM for the procedure on implementing the Virtual and Manual Timing Modes in a system.

Table 7-2 Modes Summary

Virtual or Manual IO Mode Name Data Manual Timing Mode
VIP
VIP1_MANUAL1 VIN1A/1B/2A Rise-Edge Capture Mode Timings
VIP1_2B_MANUAL1 VIN2B Rise-Edge Capture Mode Timings
VIP1_MANUAL2 VIN1A/1B/2A Fall-Edge Capture Mode Timings
VIP1_2B_MANUAL2 VIN2B Fall-Edge Capture Mode Timings
VIP2_MANUAL1 VIN3A, VIN3B IOSET1 Rise-Edge Capture Mode Timings
VIP2_4A_MANUAL1 VIN4A IOSET1/2 Rise-Edge Capture Mode Timings
VIP2_4A_IOSET3_MANUAL1 VIN4A IOSET3 Rise-Edge Capture Mode Timings
VIP2_4B_MANUAL1 VIN4B Rise-Edge Capture Mode Timings
VIP2_3B_IOSET2_MANUAL1 VIN3B IOSET2 Rise-Edge Capture Mode Timings
VIP2_3B_IOSET2_MANUAL2 VIN3B IOSET2 Fall-Edge Capture Mode Timings
VIP2_MANUAL2 VIN3A, VIN3B IOSET1, VIN4A IOSET1/2 Fall-Edge Capture Mode Timings
VIP2_4A_MANUAL2 VIN4A IOSET1/2 Fall-Edge Capture Mode Timings
VIP2_4A_IOSET3_MANUAL2 VIN4A IOSET3 Fall-Edge Capture Mode Timings
VIP2_4B_MANUAL2 VIN4B Fall-Edge Capture Mode Timings
VIP3_MANUAL1 VIN5A and VIN6A Rise-Edge Capture Mode Timings
VIP3_MANUAL2 VIN5A and VIN6A Fall-Edge Capture Mode Timings
DPI Video Output
VOUT1_MANUAL1 DPI1 Video Output Alternate Timings
VOUT1_MANUAL2 DPI1 Video Output Default Timings
VOUT1_MANUAL3 DPI1 Video Output MANUAL3 Timings
VOUT1_MANUAL4 DPI1 Video Output MANUAL4 Timings
VOUT2_IOSET1_MANUAL1 DPI2 Video Output IOSET1 Alternate Timings
VOUT2_IOSET1_MANUAL2 DPI2 Video Output IOSET1 Default Timings
VOUT2_IOSET1_MANUAL3 DPI2 Video Output IOSET1 MANUAL3 Timings
VOUT2_IOSET1_MANUAL4 DPI2 Video Output IOSET1 MANUAL4 Timings
VOUT2_IOSET2_MANUAL1 DPI2 Video Output IOSET2 Alternate Timings
VOUT2_IOSET2_MANUAL2 DPI2 Video Output IOSET2 Default Timings
VOUT2_IOSET2_MANUAL3 DPI2 Video Output IOSET2 MANUAL3 Timings
VOUT2_IOSET2_MANUAL4 DPI2 Video Output IOSET2 MANUAL4 Timings
VOUT3_MANUAL1 DPI3 Video Output Alternate Timings
VOUT3_MANUAL2 DPI3 Video Output Default Timings
VOUT3_MANUAL3 DPI3 Video Output MANUAL3 Timings
VOUT3_MANUAL4 DPI3 Video Output MANUAL4 Timings
HDMI, EMIF, Timers, I2C, UART, McSPI, USB, SATA, PCIe, DCAN, GPIO, PWM, JTAG, TPIU, RTC, SDMA, INTC
No Virtual or Manual IO Timing Mode Required All Modes
GPMC
No Virtual or Manual IO Timing Mode Required GPMC Asyncronous Mode Timings and Synchronous Mode - Default Timings
GPMC_VIRTUAL1 GPMC Synchronous Mode - Alternate Timings
QSPI
No Virtual or Manual IO Timing Mode Required QSPI Mode 3 Default Timing Mode
QSPI_MODE0_MANUAL1 QSPI Mode 0 Default Timing Mode
McASP
No Virtual or Manual IO Timing Mode Required McASP1 Synchronous Transmit Timings
MCASP1_VIRTUAL1_ASYNC_TX See Table 7-51
MCASP1_VIRTUAL2_SYNC_RX See Table 7-51
MCASP1_VIRTUAL3_ASYNC_RX See Table 7-51
No Virtual or Manual IO Timing Mode Required McASP2 Synchronous Transmit Timings
MCASP2_VIRTUAL1_ASYNC_RX_80M See Table 7-52
MCASP2_VIRTUAL2_ASYNC_RX See Table 7-52
MCASP2_VIRTUAL3_ASYNC_TX See Table 7-52
MCASP2_VIRTUAL4_SYNC_RX See Table 7-52
MCASP2_VIRTUAL5_SYNC_RX_80M See Table 7-52
No Virtual or Manual IO Timing Mode Required McASP3 Synchronous Transmit Timings
MCASP3_VIRTUAL2_SYNC_RX See Table 7-53
No Virtual or Manual IO Timing Mode Required McASP4 Synchronous Transmit Timings
MCASP4_VIRTUAL1_SYNC_RX See Table 7-54
No Virtual or Manual IO Timing Mode Required McASP5 Synchronous Transmit Timings
MCASP5_VIRTUAL1_SYNC_RX See Table 7-55
No Virtual or Manual IO Timing Mode Required McASP6 Synchronous Transmit Timings
MCASP6_VIRTUAL1_SYNC_RX See Table 7-56
No Virtual or Manual IO Timing Mode Required McASP7 Synchronous Transmit Timings
MCASP7_VIRTUAL2_SYNC_RX See Table 7-57
No Virtual or Manual IO Timing Mode Required McASP8 Synchronous Transmit Timings
MCASP8_VIRTUAL1_SYNC_RX See Table 7-58
GMAC
No Virtual or Manual IO Timing Mode Required GMAC MII1/2 Timings
GMAC_RMII0_MANUAL1 GMAC RMII0 Timings
GMAC_RMII1_MANUAL1 GMAC RMII1 Timings
GMAC_RGMII0_MANUAL1 GMAC RGMII0 Internal Delay Enabled Timings Mode
GMAC_RGMII1_MANUAL1 GMAC RGMII1 Internal Delay Enabled Timings Mode
eMMC/SD/SDIO
No Virtual or Manual IO Timing Mode Required MMC1 DS (Pad Loopback) and SDR12 (Pad Loopback) Timings
MMC1_VIRTUAL1 MMC1 HS (Internal Loopback and Pad Loopback), SDR12 (Internal Loopback), SDR25 Timings (Internal Loopback and Pad Loopback)
MMC1_VIRTUAL2 SDR50 (Pad Loopback) Timings
MMC1_VIRTUAL5 MMC1 DS (Internal Loopback) Timings
MMC1_VIRTUAL6 MMC1 SDR50 (Internal Loopback) Timings
MMC1_VIRTUAL7 MMC1 DDR50 (Internal Loopback) Timings
MMC1_DDR_MANUAL1 MMC1 DDR50 (Pad Loopback) Timings
MMC1_SDR104_MANUAL1 MMC1 SDR104 Timings
No Virtual or Manual IO Timing Mode Required MMC2 Standard (Pad Loopback), High Speed (Pad Loopback), and DDR (Pad Loopback) Timings
MMC2_DDR_LB_MANUAL1 MMC2 DDR (Internal Loopback) Timings
MMC2_HS200_MANUAL1 MMC2 HS200 Timings
MMC2_STD_HS_LB_MANUAL1 MMC2 Standard (Internal Loopback), High Speed (Internal Loopback) Timings
MMC3_MANUAL1 MMC3 DS, SDR12, HS, SDR25, SDR50 Timings
MMC4_MANUAL1 MMC4 SDR12, HS, SDR25 Timings
MMC4_DS_MANUAL1 MMC4 DS Timings