SPRSPB4A June   2024  – December 2024 TDA4APE-Q1 , TDA4VPE-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        16
          2.        17
          3.        18
      3. 5.3.2  CPSW2G
        1. 5.3.2.1 MAIN Domain
          1.        21
        2. 5.3.2.2 MCU Domain
          1.        23
      4. 5.3.3  CPTS
        1. 5.3.3.1 MAIN Domain
          1.        26
        2. 5.3.3.2 MCU Domain
          1.        28
      5. 5.3.4  CSI
        1. 5.3.4.1 MAIN Domain
          1.        31
          2.        32
          3.        33
      6. 5.3.5  DDRSS
        1. 5.3.5.1 MAIN Domain
          1.        36
          2.        37
      7. 5.3.6  Display Port
        1. 5.3.6.1 MAIN Domain
          1.        40
      8. 5.3.7  DMTIMER
        1. 5.3.7.1 MAIN Domain
          1.        43
        2. 5.3.7.2 MCU Domain
          1.        45
      9. 5.3.8  DSI
        1. 5.3.8.1 MAIN Domain
          1.        48
          2.        49
      10. 5.3.9  DSS
        1. 5.3.9.1 MAIN Domain
          1.        52
      11. 5.3.10 ECAP
        1. 5.3.10.1 MAIN Domain
          1.        55
          2.        56
          3.        57
      12. 5.3.11 EPWM
        1. 5.3.11.1 MAIN Domain
          1.        60
          2.        61
          3.        62
          4.        63
          5.        64
          6.        65
          7.        66
      13. 5.3.12 EQEP
        1. 5.3.12.1 MAIN Domain
          1.        69
          2.        70
          3.        71
      14. 5.3.13 GPIO
        1. 5.3.13.1 MAIN Domain
          1.        74
        2. 5.3.13.2 WKUP Domain
          1.        76
      15. 5.3.14 GPMC
        1. 5.3.14.1 MAIN Domain
          1.        79
      16. 5.3.15 HYPERBUS
        1. 5.3.15.1 MCU Domain
          1.        82
      17. 5.3.16 I2C
        1. 5.3.16.1 MAIN Domain
          1.        85
          2.        86
          3.        87
          4.        88
          5.        89
          6.        90
          7.        91
        2. 5.3.16.2 MCU Domain
          1.        93
          2.        94
        3. 5.3.16.3 WKUP Domain
          1.        96
      18. 5.3.17 I3C
        1. 5.3.17.1 MCU Domain
          1.        99
      19. 5.3.18 MCAN
        1. 5.3.18.1 MAIN Domain
          1.        102
          2.        103
          3.        104
          4.        105
          5.        106
          6.        107
          7.        108
          8.        109
          9.        110
          10.        111
          11.        112
          12.        113
          13.        114
          14.        115
          15.        116
          16.        117
          17.        118
          18.        119
        2. 5.3.18.2 MCU Domain
          1.        121
          2.        122
      20. 5.3.19 MCASP
        1. 5.3.19.1 MAIN Domain
          1.        125
          2.        126
          3.        127
          4.        128
          5.        129
      21. 5.3.20 MCSPI
        1. 5.3.20.1 MAIN Domain
          1.        132
          2.        133
          3.        134
          4.        135
          5.        136
          6.        137
          7.        138
        2. 5.3.20.2 MCU Domain
          1.        140
          2.        141
      22. 5.3.21 MDIO
        1. 5.3.21.1 MAIN Domain
          1.        144
          2.        145
        2. 5.3.21.2 MCU Domain
          1.        147
      23. 5.3.22 MMC
        1. 5.3.22.1 MAIN Domain
          1.        150
          2.        151
      24. 5.3.23 OSPI
        1. 5.3.23.1 MCU Domain
          1.        154
          2.        155
      25. 5.3.24 PCIE
        1. 5.3.24.1 MAIN Domain
          1.        158
      26. 5.3.25 SERDES
        1. 5.3.25.1 MAIN Domain
          1.        161
          2.        162
          3.        163
      27. 5.3.26 SGMII
        1. 5.3.26.1 MAIN Domain
          1.        166
      28. 5.3.27 UART
        1. 5.3.27.1 MAIN Domain
          1.        169
          2.        170
          3.        171
          4.        172
          5.        173
          6.        174
          7.        175
          8.        176
          9.        177
          10.        178
        2. 5.3.27.2 MCU Domain
          1.        180
        3. 5.3.27.3 WKUP Domain
          1.        182
      29. 5.3.28 UFS
        1. 5.3.28.1 MAIN Domain
          1.        185
      30. 5.3.29 USB
        1. 5.3.29.1 MAIN Domain
          1.        188
      31. 5.3.30 Emulation and Debug
        1. 5.3.30.1 MAIN Domain
          1.        191
          2.        192
      32. 5.3.31 System and Miscellaneous
        1. 5.3.31.1 Boot Mode Configuration
          1.        195
        2. 5.3.31.2 Clock
          1.        197
          2.        198
        3. 5.3.31.3 EFUSE
          1.        200
        4. 5.3.31.4 System
          1.        202
          2.        203
        5. 5.3.31.5 VMON
          1.        205
      33. 5.3.32 Power
        1.       207
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On-Hour (POH) Limits
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for AND Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 6.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 6.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 6.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 6.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 6.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0/1 PHY Mode
            1. 6.10.5.19.1.1 OSPI0/1 With PHY Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – PHY DDR Mode
          2. 6.10.5.19.2 OSPI0/1 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 OLDI
          1. 6.10.5.20.1 OLDI Switching Characteristics
        21. 6.10.5.21 PCIE
        22. 6.10.5.22 Timers
          1. 6.10.5.22.1 Timing Requirements for Timers
          2. 6.10.5.22.2 Switching Characteristics for Timers
        23. 6.10.5.23 UART
          1. 6.10.5.23.1 Timing Requirements for UART
          2. 6.10.5.23.2 UART Switching Characteristics
        24. 6.10.5.24 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 7.1.1.1 Power Distribution Network Implementation Guidance
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG and EMU
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 7.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 7.2.2.1 No Loopback and Internal Pad Loopback
        2. 7.2.2.2 External Board Loopback
        3. 7.2.2.3 DQS (only available in Octal Flash devices)
      3. 7.2.3 USB VBUS Design Guidelines
      4. 7.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 7.2.5 High Speed Differential Signal Routing Guidance
      6. 7.2.6 Thermal Solution Guidance
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • AND|1063
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

over operating free–air temperature range (unless otherwise noted)(1)(2)
PARAMETER MIN MAX UNIT
VDD_*(3) Core supplies –0.3 1.05 V
VDDAR_*(3) RAM supplies –0.3 1.05 V
VDDA_0P8_*(3) Analog supplies for 0.8V domains –0.3 1.05 V
VDDA_1P8_*(3) Analog supplies for 1.8 V PHY domains –0.3 2.2 V
VDDA_3P3_USB Analog supply for 3.3V USB domain –0.3 3.8 V
VDDA_*(3) Analog supply for 1.8V PLL and other domains –0.3 2.2 V
VDDS_DDR_*(3) DDR inteface power supplies –0.3 1.2 V
VDDS_MMC0 MMC0 IO supply –0.3 2.2 V
VDDSHV*(3) Dual Voltage LVCMOS IO supplies 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VPP_CORE VPP MCU Supply voltage range for EFUSE domains –0.3 1.89 V
USB0_VBUS(9) Voltage range for USB VBUS comparator input –0.3 3.6 V
Steady State Max. Voltage at all fail–safe IO pins I2C0_SCL, I2C0_SDA, WKUP_I2C0_SCL, WKUP_I2C0_SDA, MCU_I2C0_SCL, MCU_I2C0_SDA, EXTINTn –0.3 3.8 V
MCU_PORz, PORz –0.3 3.8 V
Steady State Max. Voltage at all other IO pins(4) VMON1_ER_VSYS(8), VMON3_IR_VEXT1P8, VMON4_IR_VEXT1P8 –0.3 2.2 V
VMON2_IR_VCPU –0.3 1.05 V
VMON5_IR_VEXT3P3 –0.3 3.8 V
All other IO pins –0.3 IO supply voltage + 0.3 V
Transient Overshoot and Undershoot specification at IO pin 20% of IO supply voltage for up to 20% of signal period
Figure 6-1 (see IO Transient Voltage Ranges)		 0.2 × VDD(7) V
Latch–up Performance, Class II (125°C)(5) I–Test –100 100 mA
Over–Voltage (OV) Test NA 1.5 × VDD(7) V
TSTG(6) Storage temperature –55 +150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to their associated VSS or VSSA_x, unless otherwise noted.
(3) VDD_* includes: VDD_CORE, VDD_CPU, VDD_MCU, VDD_MCU_WAKE1, VDD_WAKE0
VDDAR_* includes: VDDAR_CORE, VDDAR_CPU, VDDAR_MCU
VDDA_0P8_* includes: VDDA_0P8_CSIRX0_1, VDDA_0P8_CSIRX2, VDDA_0P8_DLL_MMC0, VDDA_0P8_DSITX, VDDA_0P8_DSITX_C, VDDA_0P8_PLL_DDR0, VDDA_0P8_PLL_DDR1, VDDA_0P8_PLL_DDR2, VDDA_0P8_PLL_DDR3, VDDA_0P8_SERDES_C0_1, VDDA_0P8_SERDES_C2, VDDA_0P8_SERDES_C4, VDDA_0P8_SERDES0_1, VDDA_0P8_SERDES2, VDDA_0P8_SERDES4, VDDA_0P8_UFS, VDDA_0P8_USB
VDDA_1P8_* includes: VDDA_1P8_CSIRX0_1, VDDA_1P8_CSIRX2, VDDA_1P8_DSITX, VDDA_1P8_SERDES0_1, VDDA_1P8_SERDES2, VDDA_1P8_SERDES2_4, VDDA_1P8_SERDES4, VDDA_1P8_UFS, VDDA_1P8_USB
VDDA_* includes: VDDA_ADC0, VDDA_ADC1, VDDA_MCU_PLLGRP0, VDDA_MCU_TEMP, VDDA_OSC1, VDDA_PLLGRP0, VDDA_PLLGRP1, VDDA_PLLGRP10, VDDA_PLLGRP12, VDDA_PLLGRP13, VDDA_PLLGRP2, VDDA_PLLGRP5, VDDA_PLLGRP6, VDDA_PLLGRP7, VDDA_PLLGRP8, VDDA_PLLGRP9, VDDA_POR_WKUP, VDDA_TEMP0, VDDA_TEMP1, VDDA_TEMP2, VDDA_TEMP3, VDDA_TEMP4, VDDA_WKUP
VDDS_DDR_* includes: VDDS_DDR, VDDS_DDR_C0, VDDS_DDR_C1, VDDS_DDR_C2, VDDS_DDR_C3
VDDSHV* includes: VDDSHV0, VDDSHV0_MCU, VDDSHV1_MCU, VDDSHV2, VDDSHV2_MCU, VDDSHV5
(4) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp–up and ramp–down sequences.
(5) For current pulse injection:
Pins stressed per JEDEC JESD78E (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
For overvoltage performance:
Supplies stressed per JEDEC JESD78E (Class II) and passed specified voltage injection.
(6) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage.
(7) VDD is the voltage on the corresponding power-supply pin(s) for the IO.
(8) The VMON_ER_VSYS pin provides a way to monitor the system power supply. For more information, see System Power Supply Monitor Design Guidelines using VMON/POK.
(9) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see the USB VBUS Design Guidelines.

Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off. The I2C0_SCL, I2C0_SDA, I2C1_SCL, I2C1_SDA, DDR_FS_RESETn, and NMIn are the only fail–safe IO terminals. All other IO terminals are not fail–safe and the voltage applied to them should be limited to the value defined by the Steady State Max. Voltage at all IO pins parameter in Absolute Maximum Ratings.

TDA4VPE-Q1 TDA4APE-Q1 IO Transient Voltage Ranges
A. Tovershoot + Tundershoot < 20% of Tperiod
Figure 6-1 IO Transient Voltage Ranges