JAJSLG2A April   2021  – September 2023 TDES960

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  CSI-2 Timing Specifications
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Functional Description
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1  CSI-2 Mode
      2. 7.4.2  RAW Mode
      3. 7.4.3  MODE Pin
      4. 7.4.4  REFCLK
      5. 7.4.5  Receiver Port Control
        1. 7.4.5.1 Video Stream Forwarding
      6. 7.4.6  Input Jitter Tolerance
      7. 7.4.7  Adaptive Equalizer
        1. 7.4.7.1 Channel Requirements
        2. 7.4.7.2 Adaptive Equalizer Algorithm
        3. 7.4.7.3 AEQ Settings
          1. 7.4.7.3.1 AEQ Start-Up and Initialization
          2. 7.4.7.3.2 AEQ Range
          3. 7.4.7.3.3 AEQ Timing
          4. 7.4.7.3.4 AEQ Threshold
      8. 7.4.8  Channel Monitor Loop-Through Output Driver
        1. 7.4.8.1 Code Example for CMLOUT V3LINK RX Port 0:
      9. 7.4.9  RX Port Status
        1. 7.4.9.1 RX Parity Status
        2. 7.4.9.2 V3Link Decoder Status
        3. 7.4.9.3 RX Port Input Signal Detection
        4. 7.4.9.4 Line Counter
        5. 7.4.9.5 Line Length
      10. 7.4.10 Sensor Status
      11. 7.4.11 GPIO Support
        1. 7.4.11.1 GPIO Input Control and Status
        2. 7.4.11.2 GPIO Output Pin Control
        3. 7.4.11.3 Forward Channel GPIO
        4. 7.4.11.4 Back Channel GPIO
        5. 7.4.11.5 GPIO Pin Status
        6. 7.4.11.6 Other GPIO Pin Controls
      12. 7.4.12 RAW Mode LV / FV Controls
      13. 7.4.13 CSI-2 Protocol Layer
      14. 7.4.14 CSI-2 Short Packet
      15. 7.4.15 CSI-2 Long Packet
      16. 7.4.16 CSI-2 Data Identifier
      17. 7.4.17 Virtual Channel and Context
      18. 7.4.18 CSI-2 Mode Virtual Channel Mapping
        1. 7.4.18.1 Example 1
        2. 7.4.18.2 Example 2
      19. 7.4.19 CSI-2 Transmitter Frequency
      20. 7.4.20 CSI-2 Output Bandwidth
        1. 7.4.20.1 CSI-2 Output Bandwidth Calculation Example
      21. 7.4.21 CSI-2 Transmitter Status
      22. 7.4.22 Video Buffers
      23. 7.4.23 CSI-2 Line Count and Line Length
      24. 7.4.24 FrameSync Operation
        1. 7.4.24.1 External FrameSync Control
        2. 7.4.24.2 Internally Generated FrameSync
          1. 7.4.24.2.1 Code Example for Internally Generated FrameSync
      25. 7.4.25 CSI-2 Forwarding
        1. 7.4.25.1 Best-Effort Round Robin CSI-2 Forwarding
        2. 7.4.25.2 Synchronized CSI-2 Forwarding
        3. 7.4.25.3 Basic Synchronized CSI-2 Forwarding
          1. 7.4.25.3.1 Code Example for Basic Synchronized CSI-2 Forwarding
        4. 7.4.25.4 Line-Interleaved CSI-2 Forwarding
          1. 7.4.25.4.1 Code Example for Line-Interleaved CSI-2 Forwarding
        5. 7.4.25.5 Line-Concatenated CSI-2 Forwarding
          1. 7.4.25.5.1 Code Example for Line-Concatenated CSI-2 Forwarding
        6. 7.4.25.6 CSI-2 Replicate Mode
        7. 7.4.25.7 CSI-2 Transmitter Output Control
        8. 7.4.25.8 Enabling and Disabling CSI-2 Transmitters
    5. 7.5 Programming
      1. 7.5.1  Serial Control Bus
      2. 7.5.2  Second I2C Port
      3. 7.5.3  I2C Target Operation
      4. 7.5.4  Remote Target Operation
      5. 7.5.5  Remote Target Addressing
      6. 7.5.6  Broadcast Write to Remote Devices
        1. 7.5.6.1 Code Example for Broadcast Write
      7. 7.5.7  I2C Controller Proxy
      8. 7.5.8  I2C Controller Proxy Timing
        1. 7.5.8.1 Code Example for Configuring Fast-Mode Plus I2C Operation
      9. 7.5.9  Interrupt Support
        1. 7.5.9.1 Code Example to Enable Interrupts
        2. 7.5.9.2 V3Link Receive Port Interrupts
        3. 7.5.9.3 Interrupts on Forward Channel GPIO
        4. 7.5.9.4 Interrupts on Change in Sensor Status
        5. 7.5.9.5 Code Example to Readback Interrupts
        6. 7.5.9.6 CSI-2 Transmit Port Interrupts
      10. 7.5.10 Error Handling
        1. 7.5.10.1 Receive Frame Threshold
        2. 7.5.10.2 Port PASS Control
      11. 7.5.11 Timestamp – Video Skew Detection
      12. 7.5.12 Pattern Generation
        1. 7.5.12.1 Reference Color Bar Pattern
        2. 7.5.12.2 Fixed Color Patterns
        3. 7.5.12.3 Pattern Generator Programming
          1. 7.5.12.3.1 Determining Color Bar Size
        4. 7.5.12.4 Code Example for Pattern Generator
      13. 7.5.13 V3Link BIST Mode
        1. 7.5.13.1 BIST Operation
    6. 7.6 Register Maps
      1. 7.6.1 Main Registers
      2. 7.6.2 Indirect Access Registers
        1. 7.6.2.1 PATGEN_And_CSI-2 Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Over Coax
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 VDD Power Supply
      2. 8.4.2 Power-Up Sequencing
        1. 8.4.2.1 PDB Pin
        2. 8.4.2.2 System Initialization
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground
        2. 8.5.1.2 Routing V3Link Signal Traces and PoC Filter
        3. 8.5.1.3 CSI-2 Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

Circuit board layout and stack-up for the V3Link devices must be designed to provide low-noise power feed to the device. Good layout practice also separates high frequency or high-level inputs and outputs to minimize unwanted stray noise pick-up, feedback, and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power/ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 µF to 0.1 µF. Ceramic capacitors may be in the 2.2-µF to 10-µF range. The voltage rating of the ceramic capacitors must be at least 5× the power supply voltage being used

TI recommends surface-mount capacitors due to their smaller parasitics. When using multiple capacitors per supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the 50-µF to 100-µF range, which smooths low frequency switching noise. TI recommends connecting power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor increases the inductance of the path.

A small body size X7R chip capacitor, such as 0603 or 0402, is recommended for external bypass. The small body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also common practice to use two vias from power and ground pins to the planes to reduce the impedance at high frequency.

Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as PLLs.

Use at least a four-layer board with a power and ground plane. Locate LVCMOS signals away from the differential lines to prevent coupling from the LVCMOS lines to the differential lines. Differential impedance of 100 Ω are typically recommended for STP interconnect and single-ended impedance of 50 Ω for coaxial interconnect. The closely coupled lines help to ensure that coupled noise appears as common-mode and thus is rejected by the receivers. The tightly coupled lines also radiate less.