SNLS766 July   2024 TDP20MB421

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 DC Electrical Characteristics
    6. 5.6 High-Speed Electrical Characteristics
    7. 5.7 SMBUS/I2C Timing Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 5-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 Flat Gain
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
      2. 6.4.2 Standby Mode
    5. 6.5 Programming
      1. 6.5.1 Pin Mode
      2. 6.5.2 SMBUS/I2C Register Control Interface
        1. 6.5.2.1 Shared Registers
        2. 6.5.2.2 Channel Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 DP 2.1 Mainlink Signal Conditioning
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3 Power Supply Recommendations

Follow these general guidelines when designing the power supply:

  1. Design the power supply to provide the operating conditions outlined in the recommended operating conditions section in terms of DC voltage, AC noise, and start-up ramp time.
  2. The TDP20MB421 does not require any special power supply filtering, such as ferrite beads, provided that the recommended operating conditions are met. Only standard supply decoupling is required. Typical supply decoupling consists of a 0.1µF capacitor per VCC pin, one 1µF bulk capacitor per device, and one 10µF bulk capacitor per power bus that delivers power to one or more devices. Connect the local decoupling (0.1µF) capacitors as close to the VCC pins as possible and with minimal path to the device ground pad.