JAJSKJ4N February   1977  – June 2024 TL081 , TL081A , TL081B , TL081H , TL082 , TL082A , TL082B , TL082H , TL084 , TL084A , TL084B , TL084H

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics: TL08xH
    8. 5.8  Electrical Characteristics (DC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    9. 5.9  Electrical Characteristics (AC): TL08xC, TL08xAC, TL08xBC, TL08xI, TL08xM
    10. 5.10 Typical Characteristics: TL08xH
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 General Applications
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • D|8
  • P|8
サーマルパッド・メカニカル・データ
発注情報

Thermal Information for Dual Channel

THERMAL METRIC (1) TL082xx UNIT

(SOIC)
DDF
(SOT-23)
FK
(LCCC)
JG
(CDIP)

(PDIP)
PS
(SO)
PW
(TSSOP)
U
(CFP)
8 PINS 8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 147.8 181.5 85 95 200.3 169.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 88.2 112.5 5.61 15.05 89.4 62.1 °C/W
RθJB Junction-to-board thermal resistance 91.4 98.2 131.0 176.2 °C/W
ψJT Junction-to-top characterization parameter 36.8 17.2 22.2 48.4 °C/W
ψJB Junction-to-board characterization parameter 90.6 97.6 129.3 144.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 5.4 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.