SLDS223A March   2016  – March  2016 TLC59116-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Standby
    5. 9.5 Programming
      1. 9.5.1 Characteristics of the I2C Bus
        1. 9.5.1.1 Bit Transfer
        2. 9.5.1.2 Start and Stop Conditions
        3. 9.5.1.3 Acknowledge
      2. 9.5.2 System Configuration
      3. 9.5.3 Device Address
      4. 9.5.4 Regular I2C Bus Slave Address
      5. 9.5.5 LED All Call I2C Bus Address
      6. 9.5.6 LED Sub Call I2C Bus Address
      7. 9.5.7 Software Reset I2C Bus Address
      8. 9.5.8 Control Register
    6. 9.6 Register Maps
      1. 9.6.1  Mode Register 1 (MODE1)
      2. 9.6.2  Mode Register 2 (MODE2)
      3. 9.6.3  Brightness Control Registers 0 to 15 (PWM0 to PWM15)
      4. 9.6.4  Group Duty Cycle Control Register (GRPPWM)
      5. 9.6.5  Group Frequency Register (GRPFREQ)
      6. 9.6.6  LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
      7. 9.6.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
      8. 9.6.8  LED All Call I2C Bus Address Register (ALLCALLADR)
      9. 9.6.9  Output Gain Control Register (IREF)
      10. 9.6.10 Error Flags Registers (EFLAG1, EFLAG2)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current Output
      2. 10.1.2 Adjusting Output Current
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Layout

12.1 Layout Guidelines

The I2C signals (SDA / SCL) should be kept away from potential noise sources.

The traces carrying power through the LEDs should be wide enough to the handle necessary current.

All LED current passes through the device and into the ground node. The connection between the device ground and the circuit board ground must be a strong connection.

12.2 Layout Example

Figure 25. PW-28 Layout Example

12.3 Thermal Considerations

The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given ambient temperature, use Equation 9 as a guideline:

Equation 9. TLC59116-Q1 eq2_lvsbh4.gif

where

  • PD(max) = maximum allowable power dissipation
  • TJ(max) = maximum allowable junction temperature (150°C for the TLC59116-Q1)
  • TA = ambient temperature of the device
  • ΘJA = junction to air thermal impedance.

See Thermal Information section. This parameter is highly dependent upon board layout.

Power dissipation in the device is determined by the LED current and the voltage at the OUTx pins. For example, if the LED current is 50 mA continuous through each channel and the output voltage is 1 V on each channel, then the total power dissipation is 50 mA × 1 V × 16 ch = 0.8 W.