SLVS973A September   2009  – July 2015 TLC5926-Q1 , TLC5927-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VDD = 3 V
    6. 7.6  Electrical Characteristics: VDD = 5.5 V
    7. 7.7  Timing Requirements
    8. 7.8  Switching Characteristics: VDD = 3 V
    9. 7.9  Switching Characteristics: VDD = 5.5 V
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection Principle
      2. 9.3.2 Short-Circuit Detection Principle (TLC5927-Q1 Only)
      3. 9.3.3 Overtemperature Detection and Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation Mode Switching
      2. 9.4.2 Normal Mode Phase
      3. 9.4.3 Special Mode Phase
        1. 9.4.3.1 Reading Error Status Code in Special Mode
        2. 9.4.3.2 Writing Configuration Code in Special Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current
      2. 10.1.2 Adjusting Output Current
      3. 10.1.3 16-Bit Configuration Code and Current Gain
    2. 10.2 Typical Applications
      1. 10.2.1 Single Implementation of TLC5926/TLC5927-Q1 Device
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Cascading Implementation of TLC5926/ TLC5927-Q1 Device
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

PWP Package
24-Pin HTSSOP With PowerPAD™
Top View
TLC5926-Q1 TLC5927-Q1 pinout_lvs973.gif

NOTE:

The exposed thermal pad should be connected to ground in all applications.

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
CLK 3 I Clock input for data shift on rising edge
GND 1 — Ground for control logic and current sink
LE(ED1) 4 I Data strobe input
Serial data is transferred to the respective latch when LE(ED1) is high. The data is latched when LE(ED1) goes low. Also, a control signal input for an Error Detection mode and Current Adjust mode (See Timing Diagram). LE(ED1) has an internal pulldown.
OE(ED2) 21 I Output enable. When OE (ED2)(active) is low, the output drivers are enabled; when OE(ED2) is high, all output drivers are turned OFF (blanked). Also, a control signal input for an Error Detection mode and Current Adjust mode (See Device Functional Modes). OE(ED2) has an internal pullup.
OUT0–OUT15 15, 16, 17, 18, 19, 20 O Constant-current output
R-EXT 23 I Input pin used to connect an external resistor for setting up all output currents
SDI 2 I Serial-data input to the Shift register
SDO 22 O Serial-data output to the following SDI of next driver IC or to the microcontroller
VDD 24 I Supply voltage
Exposed Thermal PAD(1) — Connect to GND. The thermal pad should be soldered to ground in all applications.
(1) The exposed Thermal PAD should be connected to ground in all applications.