SBVS146D August   2010  – December 2015 TLC5971

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  7. 7 Parametric Measurement Information
    1. 7.1 Test Circuits
    2. 7.2 Pin Equivalent Input and Output Schematics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Auto Display Repeat Function
      2. 8.3.2 Display Timing Reset Function
      3. 8.3.3 Output Timing Select Function
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Noise Reduction
    4. 8.4 Device Functional Modes
      1. 8.4.1 Maximum Constant Sink Current Setting
    5. 8.5 Programming
      1. 8.5.1 Global Brightness Control (BC) Function (Sink Current Control)
      2. 8.5.2 Grayscale (GS) Function (PWM Control)
      3. 8.5.3 Enhanced Spectrum (ES) PWM Control
      4. 8.5.4 Register and Data Latch Configuration
        1. 8.5.4.1 224-Bit Shift Register
        2. 8.5.4.2 218-Bit Data Latch
      5. 8.5.5 Internal Latch Pulse Generation Timing
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Define Basic Parameters
        2. 9.2.2.2 Data Input Sequence
        3. 9.2.2.3 How to Control the TLC5971
          1. 9.2.2.3.1 Data Write and PWM Control with Internal Grayscale Clock Mode
          2. 9.2.2.3.2 Data Write and PWM Control with External Grayscale Clock Mode
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted.(1)(2)
MIN MAX UNIT
Supply voltage, VCC –0.3 18 V
Input voltage IREF –0.3 VREG + 0.3 V
SDTI, SCKI –0.3 VREG + 0.6 V
Output voltage OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 –0.3 18 V
SDTO, SCKO –0.3 VREG + 0.3 V
VREG –0.3 6 V
Output current (DC) OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 75 mA
VREG –30 mA
Operating junction temperature, TJ (max) 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

at TA = –40°C to +85°C, and VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, unless otherwise noted.
MIN NOM MAX UNIT
DC CHARACTERISTICS
VCC Supply voltage, internal voltage regulator used 6 17 V
VREG Supply voltage, VREG connected to VCC 3 3.3 5.5 V
VO Voltage applied to output
(OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3)		 17 V
VIH High-level input voltage (SDTI, SCKI) 0.7 × VREG VREG V
VIL Low-level input voltage (SDTI, SCKI) GND 0.3 × VREG V
VIHYS Input voltage hysteresis (SDTI, SCKI) 0.2 × VREG V
IOH High-level output current (SDTO) –2 mA
IOL Low-level output current (SDTO) 2 mA
IOLC Constant output sink current
(OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3)		 60 mA
IREG Voltage regulator output current (VREG) –25 mA
TA Operating free temperature range –40 85 °C
TJ Operating junction temperature –40 125 °C
AC CHARACTERISTICS
fCLK (SCKI) Data clock frequency and GS control clock frequency, SCKI 0.007 20 MHz
tWH/tWL Pulse duration, SCKI 10 ns
tSU Setup time, SDTI – SCKI↑ 5 ns
tH Hold time, SDTI – SCKI↑ 3 ns

6.4 Thermal Information

THERMAL METRIC(1) TLC5971 UNIT
PWP (HTSSOP) RGE (VQFN)
20 PINS 24 PINS
θJA Junction-to-ambient thermal resistance 68.6 38 °C/W
θJCtop Junction-to-case (top) thermal resistance 44.2 40.5 °C/W
θJB Junction-to-board thermal resistance 19.3 10.2 °C/W
ψJT Junction-to-top characterization parameter 2.7 0.3 °C/W
ψJB Junction-to-board characterization parameter 15.7 10 °C/W
θJCbot Junction-to-case (bottom) thermal resistance 1.8 2.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TA = –40°C to +85°C, VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, VLED = 5 V, and CVREG = 1 µF, unless otherwise noted. Typical values are at TA = 25°C and VCC = 12 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage, SDTO/SCKO IOH = –2 mA VREG – 0.4 VREG V
VOL Low-level output voltage, SDTO/SCKO IOL = 2 mA 0 0.4 V
II Input current, SDTI/SCKI VI = VREG or GND –1 1 µA
ICC Supply current SDTI/SCKI = low, BLANK = 1, GSn = FFFFh,
BCX = 7Fh, VOUTXn = 1 V, RIREF = 24 kΩ (IOLCMax = 2 mA)		 2 4 mA
ICC1 SDTI/SCKI = low, BLANK = 1, GSn = FFFFh,
BCX = 7Fh, VOUTXn = 1 V, RIREF = 1.6 kΩ (IOLCMax = 30 mA)		 6 9 mA
ICC2 SDTI = 10 MHz, SCKI = 20 MHz, BLANK = 0,
auto repeat enable, external GS clock selected, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 1.6 kΩ (IOLCMax = 30 mA)		 14 22 mA
ICC3 SDTI = 10 MHz, SCKI = 20 MHz, BLANK = 0,
auto repeat enable, external GS clock selected, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 21 36 mA
IOLC Constant output current, OUTXn All OUTXn on, BCX = 7Fh, VOUTXn = 1 V,
VOUTfix = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 56.3 60.5 64.7 mA
IOLKG Leakage output current, OUTXn All OUTXn off, BCX = 7Fh, VOUTXn = 17 V,
VOUTfix = 17 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 0.1 µA
ΔIOLC Constant-current error(1)
(channel-to-channel in same color group), OUTXn		 All OUTXn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V,
RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 –3% ±1% 3%
ΔIOLC1 Constant current error(2)
(device-to-device in same color group), OUTXn		 All OUTXn on, BCX = 7Fh, VOUTXn = VOUTfix = 1V,
RIREF = 0.82 kΩ (IOLCMax = 60 mA), at same grouped color output of OUTR0-3, OUTG0-3, and OUTB0-3		 –4% ±1 4%
ΔIOLC2 Line regulation of constant-current output, OUTXn(3) All OUTn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V,
RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 –1 ±0.5 1 %/V
ΔIOLC3 Load regulation of constant-current output, OUTXn(4) All OUTn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V,
RIREF = 0.82 kΩ (IOLCMax = 60 mA)		 –3 ±1 3 %/V
TTSD Thermal shutdown temperature Junction temperature(5) 150 165 180 °C
THYS Thermal shutdown hysteresis Junction temperature(5) 5 10 20 °C
VIREF Reference voltage output, IREF RIREF = 0.82 kΩ 1.18 1.21 1.24 V
VREG Linear regulator output voltage, VREG VCC = 6 V to 17 V, IREG = 0 mA to –25 mA 3.1 3.3 3.5 V
ΔVREG Line regulation of linear regulator, VREG VCC = 6 V to 17 V, IREG = 0 mA 90 mV
ΔVREG1 Load regulation of linear regulator, VREG VCC = 12 V, IREG = 0 mA to –25 mA 120 mV
VSTR Undervoltage lockout release, VREG 2.5 2.7 2.9 V
VHYS Undervoltage lockout hysteresis, VREG 300 400 500 mV
(1)
The deviation of each output in the same color group (OUTR0-OUTR3 or OUTG0-OUTG3 or OUTB0-OUTB3) from the average current from the same color group. Deviation is calculated by Equation 1:
Equation 1. TLC5971 q_delta01_bvs146.gif

where

  • X = R/G/B,
  • n = 0-3.
(2)
The deviation of each color group constant-current average from the ideal constant-current value. Deviation is calculated by Equation 2:
Equation 2. TLC5971 q_delta02_bvs146.gif

where

  • X = R/G/B.
Ideal current is calculated by Equation 3 for the OUTRn and OUTGn groups:
Equation 3. TLC5971 q_ioutid_bvs146.gif

where

  • X = R/G/B.
(3)
Line regulation is calculated by Equation 4:
Equation 4. TLC5971 q_line_bvs146.gif

where

  • X = R/G/B,
  • n = 0-3.
(4)
Load regulation is calculated by Equation 5:
Equation 5. TLC5971 q_load_bvs146.gif

where

  • X = R/G/B,
  • n = 0-3.
(5) Not tested, specified by design.
(6) The propagation delays are calculated by tD2 = tD0 – tD1.
(7) The generation timing of the internal latch pulse changes depending on the SCKI clock frequency; see the Internal Latch Pulse Generation Timing section.

6.6 Switching Characteristics

At TA = –40°C to +85°C, VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, CVREG = 1 µF, CL = 15 pF, RL = 68 Ω, and VLED = 5 V, unless otherwise noted. Typical values are at TA = 25°C and VCC = 12 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR0 Rise time, SDTO/SCKO 3 10 ns
tR1 Rise time, OUTXn BCX = 7Fh 5 15 ns
tF0 Fall time, SDTO/SCKO 3 10 ns
tF1 Fall time, OUTXn BCX = 7Fh 15 25 ns
tD0 Propagation delay SCKI↑ to SDTO↑↓ 10 25 60 ns
tD1 SCKI↑ to SCKO↑ 5 15 40 ns
tD2(6) SCKO↑ to SDTO↑↓ 5 10 20 ns
tD3 SCKI↑ to OUTRn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1
Or SCKI↓ to OUTRn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0		 10 25 60 ns
tD4 SCKI↑ to OUTGn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1
Or SCKI↓ to OUTGn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0		 25 50 90 ns
tD5 SCKI↑ to OUTBn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1
Or SCKI↓ to OUTBn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0		 40 75 120 ns
tD6(7) Last SCKI↑ to internal latch pulse genaration 8/fOSC 16384/fOSC s
tW(SCKO) Shift clock output one pulse width SCKO↑ to SCKO↓ 12 25 35 ns
fOSC Internal oscillator frequency 6 10 12 MHz

6.7 Dissipation Ratings

PACKAGE DERATING FACTOR
ABOVE TA = 25°C		 POWER RATING
TA < 25°C		 POWER RATING
TA = 70°C		 POWER RATING
TA = 85°C
HTSSOP 20-pin with PowerPAD soldered(1) 25.7 mW/°C 3121 mW 1998 mW 1623 mW
QFN 24-pin exposed thermal pad soldered(2) 24.8 mW/°C 3106 mW 1988 mW 1615 mW
(1) With PowerPAD soldered onto copper area on TI recommended printed circuit board (PCB); 2-oz. copper. For more information, see application report PowerPAD Thermally-Enhanced Package (SLMA002) available for download at www.ti.com.
(2) The package thermal impedance is calculated in accordance with JESD51-5.
TLC5971 tim_input_bvs146.gif
1. Input pulse rise and fall time is 1 ns to 3 ns.
Figure 1. Input Timing
TLC5971 tim_output_bvs146.gif
1. Input pulse rise and fall time is 1 ns to 3 ns.
Figure 2. Output Timing
TLC5971 tim_data_wr_outtmg1_bvs146.gif
1. OUTXn ON-OFF timing depends on previous GS data in the 218-bit data latch.
2. The propagation delay time shows the period from the rising edge of the last SCKI, not the 224th SCKI to the internal latch signal generation.
Figure 3. Data Write and OUTXn Switching Timing (OUTTMG = 1)
TLC5971 tim_data_wr_outtmg0_bvs146.gif
1. OUTXn ON-OFF timing depends on previous GS data in the 218-bit data latch.
2. The propagation delay time shows the period from the rising edge of the last SCKI, not the 224th SCKI to the internal latch signal generation.
Figure 4. Data Write and OUTXn Switching Timing (OUTTMG = 0)

6.8 Typical Characteristics

At TA = 25°C and VCC = 24 V, unless otherwise noted.
TLC5971 tc_riref-iolc_bvs146.gif Figure 5. Reference Resistor vs Output Current
TLC5971 tc_io-vo_io_bvs146.gif Figure 7. Output Current vs Output Voltage
TLC5971 tc_cce-io_bvs146.gif Figure 9. Constant-Current Error vs Output Current
(Channel-to-Channel in Color Group)
TLC5971 tc_bc_line_bvs146.gif Figure 11. Global Brightness Control Linearity
TLC5971 tc_isup-ta_bvs146.gif Figure 13. Supply Current vs Ambient Temperature
TLC5971 tc_io_reg-vs_bvs146.gif Figure 15. Linear Regulator Output Voltage vs Supply Voltage
TLC5971 tc_pdiss-tmp_bvs146.gif Figure 6. Power Dissipation vs Temperature
TLC5971 tc_io-vo_ta_bvs146.gif Figure 8. Output Current vs Output Voltage
TLC5971 tc_cce-ta_bvs146.gif Figure 10. Constant-Current Error vs Ambient Temperature
(Channel-to-Channel in Color Group)
TLC5971 tc_isup-io_bvs146.gif Figure 12. Supply Current vs Output Current
TLC5971 tc_io_line-vo_reg_bvs146.gif Figure 14. Linear Regulator Output Voltage vs Linear Regulator Output Current
TLC5971 tc_wave_bvs146.gif
Figure 16. Constant-Current Output Voltage Waveform