JAJSF71D April   2018  – June 2022 TLIN1024-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC
    4. 6.4 Thermal Information
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics (1)
    8. 6.8 Timing Requirements
    9.     Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LIN (Local Interconnect Network) Bus
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2  TXD (Transmit Input/Output)
      3. 7.3.3  RXD (Receive Output)
      4. 7.3.4  VSUP1/2 (Supply Voltage)
      5. 7.3.5  GND (Ground)
      6. 7.3.6  EN (Enable Input)
      7. 7.3.7  Protection Features
      8. 7.3.8  TXD Dominant Time Out (DTO)
      9. 7.3.9  Bus Stuck Dominant System Fault: False Wake Up Lockout
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Under Voltage on VSUP
      12. 7.3.12 Unpowered Device and LIN Bus
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake Up Events
        1. 7.4.4.1 Wake Up Request (RXD)
        2. 7.4.4.2 Mode Transitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Normal Mode Application Note
        2. 8.2.2.2 Standby Mode Application Note
        3. 8.2.2.3 TXD Dominant State Timeout Application Note
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)RGY (VQFN)UNIT
24-PINS
RΘJAJunction-to-ambient thermal resistance34.3°C/W
RΘJC(top)Junction-to-case (top) thermal resistance30.8°C/W
RΘJBJunction-to-board thermal resistance13.3°C/W
ΨJTJunction-to-top characterization parameter0.5°C/W
ΨJBJunction-to-board characterization parameter13.3°C/W
RΘJC(bot)Junction-to-case (bottom) thermal resistance2.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.