SGLS244B May 2004 – December 2016 TLV2371-Q1 , TLV2372-Q1 , TLV2374-Q1
PRODUCTION DATA.
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MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage, VDD | 16.5 | V | ||
Differential input voltage, VID | ±VDD | |||
Input voltage, VI | –0.2 | VDD + 0.2 | V | |
Input current, II | ±10 | mA | ||
Output current, IO | ±100 | mA | ||
Maximum junction temperature, TJ | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | ||||
---|---|---|---|---|---|
TLV2371-Q1 in DBV package | |||||
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | All pins | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | All pins | ±500 | |||
Corner pins (1, 3, 4, and 5) | ±750 | ||||
TLV2371-Q1 in D package | |||||
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | All pins | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | All pins | ±500 | |||
Corner pins (1, 4, 5, and 8) | ±750 | ||||
TLV2372-Q1 in D package | |||||
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | All pins | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | All pins | ±500 | |||
Corner pins (1, 4, 5, and 8) | ±750 | ||||
TLV2374-Q1 in D and PW packages | |||||
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | All pins | ±2000 | V |
Charged-device model (CDM), per AEC Q100-011 | All pins | ±500 | |||
Corner pins (1, 7, 8, and 14) | ±750 |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VDD | Supply voltage | Single supply | 2.7 | 16 | V |
Split supply | ±1.35 | ±8 | |||
VICR | Common-mode input voltage | 0 | VDD | V | |
V(ON) | Turnon voltage level (relative to GND pin voltage) | 2 | V | ||
V(OFF) | Turnoff voltage level (relative to GND pin voltage) | 0.8 | V | ||
TA | Operating free-air temperature (Q-suffix) | –40 | 125 | °C |
THERMAL METRIC(1) | TLV2371-Q1 | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) | D (SOIC) | |||
5 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 228.5 | 138.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 99.1 | 89.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 54.6 | 78.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 7.7 | 29.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 53.8 | 78.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |
THERMAL METRIC(1) | TLV2372-Q1 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 138.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 89.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 78.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 29.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 78.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |
THERMAL METRIC(1) | TLV2374-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) | PW (TSSOP) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 67 | 121 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.1 | 49.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 22.5 | 62.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.2 | 5.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 22.1 | 62.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
---|---|---|---|---|---|---|---|---|
DC PERFORMANCE | ||||||||
VIO | Input offset voltage | VIC = VDD/2, VO = VDD/2, RS = 50 Ω | TA = 25°C | 2 | 4.5 | mV | ||
TA = –40°C to 125°C | 6 | |||||||
αVIO | Offset voltage drift | VIC = VDD/2, VO = VDD/2, RS = 50 Ω, TA = 25°C | 2 | µV/°C | ||||
CMRR | Common-mode rejection ratio | VDD = 2.7 V | VIC = 0 to VDD, RS = 50 Ω |
TA = 25°C | 50 | 68 | dB | |
TA = –40°C to 125°C | 49 | |||||||
VIC = 0 to VDD – 1.35 V, RS = 50 Ω |
TA = 25°C | 53 | 70 | |||||
TA = –40°C to 125°C | 54 | |||||||
VDD = 5 V | VIC = 0 to VDD, RS = 50 Ω |
TA = 25°C | 55 | 72 | ||||
TA = –40°C to 125°C | 54 | |||||||
VIC = 0 to VDD – 1.35 V, RS = 50 Ω |
TA = 25°C | 58 | 80 | |||||
TA = –40°C to 125°C | 57 | |||||||
VDD = 15 V | VIC = 0 to VDD, RS = 50 Ω |
TA = 25°C | 64 | 82 | ||||
TA = –40°C to 125°C | 63 | |||||||
VIC = 0 to VDD – 1.35 V, RS = 50 Ω |
TA = 25°C | 67 | 84 | |||||
TA = –40°C to 125°C | 66 | |||||||
AVD | Large-signal differential voltage amplification | VO(PP) = VDD/2, RS = 10 Ω |
VDD = 2.7 V | TA = 25°C | 95 | 106 | dB | |
TA = –40°C to 125°C | 76 | |||||||
VDD = 5 V | TA = 25°C | 80 | 110 | |||||
TA = –40°C to 125°C | 82 | |||||||
VDD = 15 V | TA = 25°C | 77 | 83 | |||||
TA = –40°C to 125°C | 79 | |||||||
INPUT | ||||||||
IIO | Input offset current | VDD = 15 V, VIC = VDD/2, VO = VDD/2 | TA = 25°C | 1 | 60 | pA | ||
TA = –40°C to 125°C | 500 | |||||||
IIB | Input bias current | VDD = 15 V, VIC = VDD/2, VO = VDD/2 | TA = 25°C | 1 | 60 | pA | ||
TA = –40°C to 125°C | 500 | |||||||
ri(d) | Differential input resistance | TA = 25°C | 1000 | GΩ | ||||
CIC | Common-mode input capacitance | f = 21 kHz, TA = 25°C | 8 | pF | ||||
OUTPUT | ||||||||
VOH | High-level output voltage | VIC = VDD/2, IOH = –1 mA, VID = 1 V |
VDD = 2.7 V | TA = 25°C | 2.55 | 2.58 | V | |
TA = –40°C to 125°C | 2.48 | |||||||
VDD = 5 V | TA = 25°C | 4.9 | 4.93 | |||||
TA = –40°C to 125°C | 4.85 | |||||||
VDD = 15 V | TA = 25°C | 14.92 | 14.96 | |||||
TA = –40°C to 125°C | 14.9 | |||||||
VIC = VDD/2, IOH = –5 mA, VID = 1 V |
VDD = 2.7 V | TA = 25°C | 1.88 | 2 | ||||
TA = –40°C to 125°C | 1.42 | |||||||
VDD = 5 V | TA = 25°C | 4.58 | 4.68 | |||||
TA = –40°C to 125°C | 4.44 | |||||||
VDD = 15 V | TA = 25°C | 14.7 | 14.8 | |||||
TA = –40°C to 125°C | 14.6 | |||||||
VOL | Low-level output voltage | VIC = VDD/2, IOH = 1 mA, VID = 1 V |
VDD = 2.7 V | TA = 25°C | 0.1 | 0.15 | V | |
TA = –40°C to 125°C | 0.22 | |||||||
VDD = 5 V | TA = 25°C | 0.05 | 0.1 | |||||
TA = –40°C to 125°C | 0.15 | |||||||
VDD = 15 V | TA = 25°C | 0.05 | 0.08 | |||||
TA = –40°C to 125°C | 0.1 | |||||||
VIC = VDD/2, IOH = 5 mA, VID = 1 V |
VDD = 2.7 V | TA = 25°C | 0.52 | 0.7 | ||||
TA = –40°C to 125°C | 1.15 | |||||||
VDD = 5 V | TA = 25°C | 0.28 | 0.4 | |||||
TA = –40°C to 125°C | 0.54 | |||||||
VDD = 15 V | TA = 25°C | 0.19 | 0.3 | |||||
TA = –40°C to 125°C | 0.35 | |||||||
POWER SUPPLY | ||||||||
IDD | Supply current (per channel) |
VO = VDD/2 | VDD = 2.7 V | TA = 25°C | 470 | 560 | µA | |
VDD = 5 V | TA = 25°C | 550 | 660 | |||||
VDD = 15 V | TA = 25°C | 750 | 900 | |||||
TA = –40°C to 125°C | 1200 | |||||||
PSRR | Supply voltage rejection ratio (ΔVDD/ΔVIO) | VDD = 2.7 V to 15 V, VIC = VDD/2, no load |
TA = 25°C | 70 | 80 | dB | ||
TA = –40°C to 125°C | 65 | |||||||
DYNAMIC PERFORMANCE | ||||||||
UGBW | Unity gain bandwidth | RL = 2 kΩ, CL = 10 pF | VDD = 2.7 V, TA = 25°C | 2.4 | MHz | |||
VDD = 5 V to 15 V, TA = 25°C |
3 | |||||||
SR | Slew rate at unity gain | VO(PP) = VDD/2, RL = 10 kΩ, CL = 50 pF |
VDD = 2.7 V | TA = 25°C | 1.4 | 2 | V/µs | |
TA = –40°C to 125°C | 1 | |||||||
VDD = 5 V | TA = 25°C | 1.4 | 2.4 | |||||
TA = –40°C to 125°C | 1.2 | |||||||
VDD = 15 V | TA = 25°C | 1.9 | 2.1 | |||||
TA = –40°C to 125°C | 1.4 | |||||||
φm | Phase margin | RL = 2 kΩ, CL = 100 pF, TA = 25°C | 65° | |||||
Gain margin | RL = 2 kΩ, CL = 10 pF, TA = 25°C | 18 | dB | |||||
ts | Settling time | VDD = 2.7 V, V(STEP)PP = 1 V, AV = –1, RL = 2 kΩ, CL = 10 pF, 0.1% at 25°C |
2.9 | µs | ||||
VDD = 5 V or 15 V, V(STEP)PP = 1 V, AV = –1, RL = 2 kΩ, CL = 47 pF, 0.1% at 25°C |
2 | |||||||
NOISE/DISTORTION PERFORMANCE | ||||||||
THD+N | Total harmonic distortion plus noise | VDD = 2.7 V, VO(PP) = VDD/2 V, RL = 2 kΩ, f = 10 kHz, TA = 25°C |
AV = 1 | 0.02% | ||||
AV = 10 | 0.05% | |||||||
AV = 100 | 0.18% | |||||||
VDD = 5 V or 15 V, VO(PP) = VDD/2 V, RL = 2 kΩ, f = 10 kHz, TA = 25°C |
AV = 1 | 0.02% | ||||||
AV = 10 | 0.09% | |||||||
AV = 100 | 0.5% | |||||||
Vn | Equivalent input noise voltage | f = 1 kHz, TA = 25°C | 39 | nV√Hz | ||||
f = 10 kHz, TA = 25°C | 35 | |||||||
In | Equivalent input noise current | f = 1 kHz, TA = 25°C | 0.6 | fA√Hz |
FIGURE | |||
---|---|---|---|
VIO | Input offset voltage | vs Common-mode input voltage | Figure 1, Figure 2, Figure 3 |
CMRR | Common-mode rejection ratio | vs Frequency | Figure 4 |
Input bias and offset current | vs Free-air temperature | Figure 5 | |
VOL | Low-level output voltage | vs Low-level output current | Figure 6, Figure 8, Figure 10 |
VOH | High-level output voltage | vs High-level output current | Figure 7, Figure 9, Figure 11 |
VO(PP) | Peak-to-peak output voltage | vs Frequency | Figure 12 |
IDD | Supply current | vs Supply voltage | Figure 13 |
PSRR | Power supply rejection ratio | vs Frequency | Figure 14 |
AVD | Differential voltage gain & phase | vs Frequency | Figure 15 |
Gain-bandwidth product | vs Free-air temperature | Figure 16 | |
SR | Slew rate | vs Supply voltage | Figure 17 |
vs Free-air temperature | Figure 18 | ||
φm | Phase margin | vs Capacitive load | Figure 19 |
Vn | Equivalent input noise voltage | vs Frequency | Figure 20 |
Voltage-follower large-signal pulse response | Figure 21, Figure 22 | ||
Voltage-follower small-signal pulse response | Figure 23 | ||
Inverting large-signal response | Figure 24, Figure 25 | ||
Inverting small-signal response | Figure 26 | ||
Crosstalk | vs Frequency | Figure 27 |