JAJSN62C february   2004  – april 2023 TLV3011 , TLV3011B , TLV3012 , TLV3012B

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings- TLV3011 and TLV3012
    2. 6.2  Absolute Maximum Ratings - TLV3011B and TLV3012B
    3. 6.3  ESD Ratings
    4. 6.4  Thermal Information - TLV3011 and TLV3012
    5. 6.5  Thermal Information- TLV3011B and TLV3012B
    6. 6.6  Recommended Operating Conditions
    7. 6.7  Electrical Characteristics - TLV3011 and TLV3012
    8. 6.8  Switching Characteristics - TLV3011 and TLV3012
    9. 6.9  Electrical Characteristics - TLV3011B and TLV3012B
    10. 6.10 Switching Characteristics - TLV3011B and TLV3012B
  7. 7 Typical Characteristics - TLV3011 and TLV3012
  8. 8 Typical Characteristics - TLV3011B and TLV3012B
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Open Drain Output (TLV3011 and TLV3011B)
      2. 9.4.2 Push-Pull Output (TLV3012 and TLV3012B)
      3. 9.4.3 Voltage Reference
      4. 9.4.4 TLV3011B and TLV3012B Fail-Safe inputs
      5. 9.4.5 TLV3011B and TLV3012B Power On Reset
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 External Hysteresis
      2. 10.1.2 TLV3011B and TLV3012B Hysteresis
    2. 10.2 Typical Application
      1. 10.2.1 Under-Voltage Detection
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
    3. 10.3 System Examples
      1. 10.3.1 Power-On Reset
      2. 10.3.2 Relaxation Oscillator
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information - TLV3011 and TLV3012

THERMAL METRIC(1)TLV3011, TLV3012UNIT
DCK
(SC-70)		DBV
(SOT-23)
6 PINS6 PINS

RθJA

Junction-to-ambient thermal resistance

179.4

191.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

141.3

123.9

°C/W

RθJB

Junction-to-board thermal resistance

71.2

38.7

°C/W

ψJT

Junction-to-top characterization parameter

53.6

21.2

°C/W

ψJB

Junction-to-board characterization parameter

71.0

38.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.