JAJSCS9B November   2016  – August 2017 TLV2316-Q1 , TLV316-Q1 , TLV4316-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV316-Q1
    5. 7.5 Thermal Information: TLV2316-Q1
    6. 7.6 Thermal Information: TLV4316-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
      7. 8.3.7 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 改訂履歴

Changes from A Revision (December 2016) to B Revision

  • 誤字の修正、「特長」セクションで部品番号をTLV314、TLV2314、TLV4314からTLV316-Q1、TLV2316-Q1、TLV4316-Q1に変更Go
  • Changed values in the Thermal Information: TLV4316-Q1 table to align with JEDEC standards.Go

Changes from * Revision (November 2016) to A Revision

  • Changed 「特長」セクションでCDM ESD分類レベルをC6からC5にGo
  • Deleted 「製品情報」表からSC70 (5)、SOIC (8)、SOIC (14)パッケージをGo
  • Deleted the DCK (SC70) package from the TLV316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the DCK (SC70) pinout information from the Pin Functions: TLV316-Q1 table in the Pin Configurations and Functions section Go
  • Deleted D (SOIC) package from the TLV2316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the D (SOIC) package from TLV4316-Q1 pinout diagram in the Pin Configurations and Functions sectionGo
  • Changed the ESD Ratings table from commercial to automotive specifications Go
  • Changed the CDM ESD rating from ±1500 to ±750 in the ESD Ratings table Go
  • Deleted the DCK (SC70) package from the Thermal Information: TLV316-Q1 table in the Specifications sectionGo
  • Changed the formatting of all Thermal Information table notes Go
  • Deleted the D (SOIC) package from the Thermal Information: TLV2316-Q1 table in the Specifications sectionGo
  • Deleted the D (SOIC) package from the Thermal Information: TLV4316-Q1 table in the Specifications section Go
  • Deleted the static literature number in the SBOA128 application note reference in the EMI Susceptibility and Input Filtering sectionGo
  • Deleted the static literature number in document reference in the Layout Guidelines section Go
  • Changed the layout example image (Figure 41) in Layout Example sectionGo
  • Deleted 「関連資料」セクションでドキュメントの参照に含まれる静的な文書番号Go