JAJSQ46A April 2023 – August 2024 TLV9161-Q1 , TLV9162-Q1 , TLV9164-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TLV9164-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
|||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 94.9 | 120.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 51.1 | 50.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 51.4 | 63.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 15.3 | 8.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 51.0 | 62.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |