THERMAL METRIC(1) |
RDH (QFN) |
UNIT |
30 PINS |
RθJA |
Junction-to-ambient thermal resistance (TPSM63603 EVM) |
29.1 |
°C/W |
RθJA |
Junction-to-ambient thermal resistance(2) |
33.5 |
°C/W |
ψJT |
Junction-to-top characterization parameter(3) |
4.1 |
°C/W |
ψJB |
Junction-to-board characterization parameter(4) |
21.5 |
°C/W |
(2) The junction-to-ambient thermal resistance, RθJA, applies to
devices soldered directly to a 64-mm × 83-mm four-layer PCB with 2-oz. copper and natural
convection cooling. Additional airflow and PCB copper area reduces RθJA. For more
information see the Layout section.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB,
estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB ×
Pdis + TB; where Pdis is the power dissipated in the
device and TB is the temperature of the board 1 mm from the device.