THERMAL METRIC(1) |
RDL (QFN) |
UNIT |
20 PINS |
RθJA |
Junction-to-ambient thermal resistance (TLVM13660 EVM) |
22.6 |
°C/W |
RθJA |
Junction-to-ambient thermal resistance (2) |
33.1 |
°C/W |
ψJT |
Junction-to-top characterization parameter (3) |
1 |
°C/W |
ψJB |
Junction-to-board characterization parameter (4) |
12.3 |
°C/W |
(2) The junction-to-ambient thermal resistance, RθJA, applies to
devices soldered directly to a 75-mm × 75-mm four-layer PCB with 2 oz. copper and natural
convection cooling. Additional airflow and PCB copper area reduces RθJA.
(3) The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × PDIS + TT; where PDIS is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × PDIS + TB; where PDIS is the power dissipated in the device and TB is the temperature of the board 1mm from the device.