JAJSMO7D August   2021  – September 2022 TMAG5231

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Magnetic Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Magnetic Flux Direction
      2. 8.3.2 Magnetic Response
      3. 8.3.3 Output Type
      4. 8.3.4 Sampling Rate
      5. 8.3.5 Hall Element Location
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Defining the Design Implementation
    2. 9.2 Typical Applications
      1. 9.2.1 Hinge
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Head-On
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Slide-By
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 サポート・リソース
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical and Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1.1 Defining the Design Implementation

The first step of design is identifying your general design implementation, which means you will define whether you are detecting a magnet sliding past the sensor, moving head-on toward the sensor, or swinging toward the sensor on a hinge. Figure 9-1 shows examples for each of the aforementioned design implementations.

GUID-20211013-SS0I-34XT-K936-3KK5358H5RF2-low.pngFigure 9-1 Design Implementations

With each implementation, the objective is to design the system such that the spatial coordinates of the transition region fall within the spatial coordinates associated with the BOP maximum and BRP minimum specifications. Figure 9-2 shows a head-on example that shows how the location corresponding to the device BOPMAX and BRPMIN fall within the desired transition region. To facilitate rapid design iteration, TI’s Magnetic Sensing Proximity Tool is leveraged in the following design examples.

GUID-20211013-SS0I-PJV8-M9B0-MKQMRSRF5FJ1-low.pngFigure 9-2 Head-On Example