JAJSJS6B June   2021  – July 2024 TMAG5273

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Temperature Sensor
    7. 5.7  Magnetic Characteristics For A1, B1, C1, D1
    8. 5.8  Magnetic Characteristics For A2, B2, C2, D2
    9. 5.9  Magnetic Temp Compensation Characteristics
    10. 5.10 I2C Interface Timing
    11. 5.11 Power up & Conversion Time
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Interrupt Function
      4. 6.3.4 Device I2C Address
      5. 6.3.5 Magnetic Range Selection
      6. 6.3.6 Update Rate Settings
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby (Trigger) Mode
      2. 6.4.2 Sleep Mode
      3. 6.4.3 Wake-up and Sleep (W&S) Mode
      4. 6.4.4 Continuous Measure Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 SCL
        2. 6.5.1.2 SDA
        3. 6.5.1.3 I2C Read/Write
          1. 6.5.1.3.1 Standard I2C Write
          2. 6.5.1.3.2 General Call Write
          3. 6.5.1.3.3 Standard 3-Byte I2C Read
          4. 6.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 6.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 6.5.1.3.6 I2C Read CRC
      2. 6.5.2 Data Definition
        1. 6.5.2.1 Magnetic Sensor Data
        2. 6.5.2.2 Temperature Sensor Data
        3. 6.5.2.3 Angle and Magnitude Data Definition
        4. 6.5.2.4 Magnetic Sensor Offset Correction
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Select the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Magnetic Limit Check
      5. 7.1.5 Error Calculation During Linear Measurement
      6. 7.1.6 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Magnetic Tamper Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 I2C Address Expansion
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Angle Measurement
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
          1. 7.2.3.2.1 Gain Adjustment for Angle Measurement
        3. 7.2.3.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Maps
    1. 8.1 TMAG5273 Registers
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TMAG5273 UNIT
DBV (SOT-23)
6 pins
RθJA Junction-to-ambient thermal resistance 162 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.6 °C/W
RθJB Junction-to-board thermal resistance 50.1 °C/W
ΨJT Junction-to-top characterization parameter 30.7 °C/W
ΨJB Junction-to-board characterization parameter 49.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.