JAJSNP8B March   2023  – August 2024 TMAG6181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensors Location and Placement Tolerances
      3. 6.3.3 Magnetic Response
      4. 6.3.4 Parameters Definition
        1. 6.3.4.1 AMR Output Parameters
        2. 6.3.4.2 Transient Parameters
          1. 6.3.4.2.1 Power-On Time
        3. 6.3.4.3 Hall Sensor Parameters
        4. 6.3.4.4 Angle Accuracy Parameters
      5. 6.3.5 Automatic Gain Control (AGC)
      6. 6.3.6 Turns Counter
        1. 6.3.6.1 Rotation Tracking
      7. 6.3.7 Safety and Diagnostics
        1. 6.3.7.1 Device Level Checks
        2. 6.3.7.2 System Level Checks
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Active-Turns Mode
        3. 6.4.1.3 Low-Power Mode
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Fault Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Supply as the Reference for External ADC
      2. 7.1.2 AMR Output Dependence on Airgap Distance
      3. 7.1.3 Calibration of Sensor Errors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Designing with Multiple Sensors
          1. 7.2.2.1.1 Designing for Redundancy
          2. 7.2.2.1.2 Multiplexing Multiple Sensors
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TMAG6181-Q1 UNIT
DGK (VSSOP)
8  PINS
RθJA Junction-to-ambient thermal resistance 166.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57.8 °C/W
RθJB Junction-to-board thermal resistance 88.7 °C/W
ΨJT Junction-to-top characterization parameter 7.0 °C/W
ΨJB Junction-to-board characterization parameter 87.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.