JAJSDF4A May   2017  – May 2019 TMP116

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
      2.      温度精度
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Interface Timing
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Conversions
        1. 7.4.1.1 Conversion Cycle
        2. 7.4.1.2 Averaging
        3. 7.4.1.3 Continuous Conversion Mode (CC)
        4. 7.4.1.4 Shutdown Mode (SD)
        5. 7.4.1.5 One-Shot Mode (OS)
      2. 7.4.2 Therm and Alert Modes
        1. 7.4.2.1 Alert Mode
        2. 7.4.2.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Registers Map
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  Temperature Register (address = 00h) [default reset = 8000h]
          1. Table 5. Temperature Register Field Descriptions
        2. 7.6.1.2  Configuration Register (address = 01h) [Factory default reset = 0220h]
          1. Table 6. Configuration Register Field Descriptions
        3. 7.6.1.3  High Limit Register (address = 02h) [Factory default reset = 6000h]
          1. Table 8. High Limit Register Field Descriptions
        4. 7.6.1.4  Low Limit Register (address = 03h) [Factory default reset = 8000h]
          1. Table 9. Low Limit Register Field Descriptions
        5. 7.6.1.5  EEPROM Unlock Register (address = 04h) [reset = 0000h]
          1. Table 10. EEPROM Unlock Register Field Descriptions
        6. 7.6.1.6  EEPROM1 Register (address = 05h) [reset = XXXXh]
          1. Table 11. EEPROM1 Register Field Descriptions
        7. 7.6.1.7  EEPROM2 Register (address = 06h) [reset = XXXXh]
          1. Table 12. EEPROM2 Register Field Descriptions
        8. 7.6.1.8  EEPROM3 Register (address = 07h) [reset = 0000h]
          1. Table 13. EEPROM3 Register Field Descriptions
        9. 7.6.1.9  EEPROM4 Register (address = 08h) [reset = XXXXh]
          1. Table 14. EEPROM4 Register Field Descriptions
        10. 7.6.1.10 Device ID Register (address = 0Fh) [reset = 1116h]
          1. Table 15. Device ID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Noise and Averaging
          2. 8.1.1.2.2 Self-Heating Effect (SHE)
          3. 8.1.1.2.3 Synchronized Temperature Measurements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TMP116 UNIT
DRV (WSON)
6 PINS
RθJA Junction-to-ambient thermal resistance 68.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.5 °C/W
RθJB Junction-to-board thermal resistance 38.3 °C/W
ψJT Junction-to-top characterization parameter 1.7 °C/W
ψJB Junction-to-board characterization parameter 38.6 °C/W
MT Thermal Mass 5.1 mJ/°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.