JAJSD83C May   2017  – October 2019 TMP464

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Two-Wire Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Differential Input Capacitance
      4. 8.3.4 Sensor Fault
      5. 8.3.5 THERM Functions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Bus Overview
        2. 8.5.1.2 Bus Definitions
        3. 8.5.1.3 Serial Bus Address
        4. 8.5.1.4 Read and Write Operations
          1. 8.5.1.4.1 Single Register Reads
          2. 8.5.1.4.2 Block Register Reads
        5. 8.5.1.5 Timeout Function
        6. 8.5.1.6 High-Speed Mode
      2. 8.5.2 TMP464 Register Reset
      3. 8.5.3 Lock Register
    6. 8.6 Register Maps
      1. 8.6.1 Register Information
        1. 8.6.1.1  Pointer Register
        2. 8.6.1.2  Local and Remote Temperature Value Registers
        3. 8.6.1.3  Software Reset Register
        4. 8.6.1.4  THERM Status Register
        5. 8.6.1.5  THERM2 Status Register
        6. 8.6.1.6  Remote Channel Open Status Register
        7. 8.6.1.7  Configuration Register
        8. 8.6.1.8  η-Factor Correction Register
        9. 8.6.1.9  Remote Temperature Offset Register
        10. 8.6.1.10 THERM Hysteresis Register
        11. 8.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 8.6.1.12 Block Read - Auto Increment Pointer
        13. 8.6.1.13 Lock Register
        14. 8.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.7 Typical Characteristics

at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
TMP464 D002_SBOS762.gif
Typical behavior of 75 devices over temperature at V+ = 1.8 V
Figure 2. Local Temperature Error vs Ambient Temperature
TMP464 D005_SBOS762_150C_1p8V-3p6V_Visio.gif
Typical behavior of 30 devices over temperature with V+ from 1.8 V to 3.6 V
Figure 4. Remote Temperature Error Power Supply Sensitivity vs Device Junction Temperature
TMP464 D007_SBOS762.gif
No physical capacitance during measurement
Figure 6. Remote Temperature Error vs Series Resistance
TMP464 D009_SBOS762.gif
Figure 8. Quiescent Current vs Conversion Rate °
TMP464 D011_SBOS762.gif
Figure 10. Quiescent Current vs Supply Voltage
(at Default Conversion Rate of 16 Conversions Per Second)
TMP464 D004_SBOS762.gif
Typical behavior of 75 devices over temperature at V+ = 1.8 V with the remote diode junction at 150°C.
Figure 3. Remote Temperature Error vs Device Junction Temperature
TMP464 D006_SBOS762.gif
Figure 5. Remote Temperature Error vs Leakage Resistance
TMP464 D008_SBOS762.gif
No physical series resistance on D+, D– pins during measurement
Figure 7. Remote Temperature Error vs
Differential Capacitance
TMP464 D010_SBOS762.gif
Figure 9. Shutdown Quiescent Current
vs SCL Clock Frequency
TMP464 D012_SBOS762.gif
Figure 11. Shutdown Quiescent Current vs Supply Voltage