JAJSD83C May   2017  – October 2019 TMP464

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Two-Wire Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Series Resistance Cancellation
      3. 8.3.3 Differential Input Capacitance
      4. 8.3.4 Sensor Fault
      5. 8.3.5 THERM Functions
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Bus Overview
        2. 8.5.1.2 Bus Definitions
        3. 8.5.1.3 Serial Bus Address
        4. 8.5.1.4 Read and Write Operations
          1. 8.5.1.4.1 Single Register Reads
          2. 8.5.1.4.2 Block Register Reads
        5. 8.5.1.5 Timeout Function
        6. 8.5.1.6 High-Speed Mode
      2. 8.5.2 TMP464 Register Reset
      3. 8.5.3 Lock Register
    6. 8.6 Register Maps
      1. 8.6.1 Register Information
        1. 8.6.1.1  Pointer Register
        2. 8.6.1.2  Local and Remote Temperature Value Registers
        3. 8.6.1.3  Software Reset Register
        4. 8.6.1.4  THERM Status Register
        5. 8.6.1.5  THERM2 Status Register
        6. 8.6.1.6  Remote Channel Open Status Register
        7. 8.6.1.7  Configuration Register
        8. 8.6.1.8  η-Factor Correction Register
        9. 8.6.1.9  Remote Temperature Offset Register
        10. 8.6.1.10 THERM Hysteresis Register
        11. 8.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 8.6.1.12 Block Read - Auto Increment Pointer
        13. 8.6.1.13 Lock Register
        14. 8.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1 Application Information

The TMP464 device requires a transistor connected between the D+ and D– pins for remote temperature measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local bypassing. Figure 20 and Figure 21 illustrate the typical configurations for the TMP464 device.