JAJSFZ4E March   2009  – August 2018 TMS320C28341 , TMS320C28342 , TMS320C28343 , TMS320C28344 , TMS320C28345 , TMS320C28346

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings – Automotive
    3. 5.3 ESD Ratings – Commercial
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Power Consumption Summary
      1. Table 5-1 TMS320C28346/C28344 Current Consumption by Power-Supply Pins at 300-MHz SYSCLKOUT
      2. Table 5-2 TMS320C28345/C28343 Current Consumption by Power-Supply Pins at 200-MHz SYSCLKOUT
      3. 5.5.1     Reducing Current Consumption
    6. 5.6 Electrical Characteristics
    7. 5.7 Thermal Resistance Characteristics
      1. 5.7.1 ZHH Package
      2. 5.7.2 ZFE Package
    8. 5.8 Thermal Design Considerations
    9. 5.9 Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-4 Clocking and Nomenclature (300-MHz Devices)
          2. Table 5-5 Clocking and Nomenclature (200-MHz Devices)
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-6 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-7 XCLKIN/X1 Timing Requirements – PLL Enabled
        2. Table 5-8 XCLKIN/X1 Timing Requirements – PLL Disabled
        3. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-10 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-11 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-12 IDLE Mode Timing Requirements
            2. Table 5-13 IDLE Mode Switching Characteristics
            3. Table 5-14 STANDBY Mode Timing Requirements
            4. Table 5-15 STANDBY Mode Switching Characteristics
            5. Table 5-16 HALT Mode Timing Requirements
            6. Table 5-17 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-18 ePWM Timing Requirements
            2. Table 5-19 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-20 Trip-Zone Input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-21 High-Resolution PWM Characteristics at SYSCLKOUT = (150–300 MHz)
          4. 5.9.4.2.4 Enhanced Capture (eCAP) Timing
            1. Table 5-22 Enhanced Capture (eCAP) Timing Requirements
            2. Table 5-23 eCAP Switching Characteristics
          5. 5.9.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. Table 5-24 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. Table 5-25 eQEP Switching Characteristics
          6. 5.9.4.2.6 ADC Start-of-Conversion Timing
            1. Table 5-26 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-27 External Interrupt Timing Requirements
          2. Table 5-28 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-29 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Timing
          1. 5.9.4.5.1 Master Mode Timing
            1. Table 5-30 SPI Master Mode External Timing (Clock Phase = 0)
            2. Table 5-31 SPI Master Mode External Timing (Clock Phase = 1)
          2. 5.9.4.5.2 Slave Mode Timing
            1. Table 5-32 SPI Slave Mode External Timing (Clock Phase = 0)
            2. Table 5-33 SPI Slave Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 Multichannel Buffered Serial Port (McBSP) Timing
          1. 5.9.4.6.1 McBSP Transmit and Receive Timing
            1. Table 5-34 McBSP Timing Requirements
            2. Table 5-35 McBSP Switching Characteristics
          2. 5.9.4.6.2 McBSP as SPI Master or Slave Timing
            1. Table 5-36 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 5-37 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 5-38 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 5-39 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 5-40 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 5-41 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 5-42 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 5-43 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      5. 5.9.5 Emulator Connection Without Signal Buffering for the MCU
      6. 5.9.6 External Interface (XINTF) Timing
        1. 5.9.6.1 USEREADY = 0
        2. 5.9.6.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
        3. 5.9.6.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
        4. 5.9.6.4 XINTF Signal Alignment to XCLKOUT
        5. 5.9.6.5 External Interface Read Timing
          1. Table 5-46 External Interface Read Timing Requirements
          2. Table 5-47 External Interface Read Switching Characteristics
        6. 5.9.6.6 External Interface Write Timing
          1. Table 5-48 External Interface Write Switching Characteristics
        7. 5.9.6.7 External Interface Ready-on-Read Timing With One External Wait State
          1. Table 5-49 External Interface Read Switching Characteristics (Ready-on-Read, One Wait State)
          2. Table 5-50 External Interface Read Timing Requirements (Ready-on-Read, One Wait State)
          3. Table 5-51 Synchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
          4. Table 5-52 Asynchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
        8. 5.9.6.8 External Interface Ready-on-Write Timing With One External Wait State
          1. Table 5-53 External Interface Write Switching Characteristics (Ready-on-Write, One Wait State)
          2. Table 5-54 Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
          3. Table 5-55 Asynchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
        9. 5.9.6.9 XHOLD and XHOLDA Timing
          1. Table 5-56 XHOLD/XHOLDA Timing Requirements
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  External Interface (XINTF)
      6. 6.1.6  M0, M1 SARAMs
      7. 6.1.7  L0, L1, L2, L3, L4, L5, L6, L7, H0, H1, H2, H3, H4, H5 SARAMs
      8. 6.1.8  Boot ROM
      9. 6.1.9  Security
      10. 6.1.10 Peripheral Interrupt Expansion (PIE) Block
      11. 6.1.11 External Interrupts (XINT1–XINT7, XNMI)
      12. 6.1.12 Oscillator and PLL
      13. 6.1.13 Watchdog
      14. 6.1.14 Peripheral Clocking
      15. 6.1.15 Low-Power Modes
      16. 6.1.16 Peripheral Frames 0, 1, 2, 3 (PFn)
      17. 6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
      18. 6.1.18 32-Bit CPU-Timers (0, 1, 2)
      19. 6.1.19 Control Peripherals
      20. 6.1.20 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1  DMA Overview
      2. 6.2.2  32-Bit CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
      3. 6.2.3  Enhanced PWM Modules
      4. 6.2.4  High-Resolution PWM (HRPWM)
      5. 6.2.5  Enhanced CAP Modules
      6. 6.2.6  Enhanced QEP Modules
      7. 6.2.7  External ADC Interface
      8. 6.2.8  Multichannel Buffered Serial Port (McBSP) Module
      9. 6.2.9  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      10. 6.2.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
      11. 6.2.11 Serial Peripheral Interface (SPI) Module (SPI-A, SPI-D)
      12. 6.2.12 Inter-Integrated Circuit (I2C)
      13. 6.2.13 GPIO MUX
      14. 6.2.14 External Interface (XINTF)
    3. 6.3 Memory Maps
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8デバイスおよびドキュメントのサポート
    1. 8.1 はじめに
    2. 8.2 デバイスおよび開発ツールの項目表記
    3. 8.3 ツールとソフトウェア
    4. 8.4 ドキュメントのサポート
    5. 8.5 関連リンク
    6. 8.6 Community Resources
    7. 8.7 商標
    8. 8.8 静電気放電に関する注意事項
    9. 8.9 Glossary
  9. 9メカニカル、パッケージ、および注文情報
    1. 9.1 パッケージ情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
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発注情報

5.8 Thermal Design Considerations

Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions.