JAJSDV7F June 2009 – January 2017 TMS320C6742
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
The following table shows the thermal resistance characteristics for the PBGA–ZCE mechanical package.
NO. | °C/W(1) | AIR FLOW (m/s)(2) | ||
---|---|---|---|---|
1 | RΘJC | Junction-to-case | 7.6 | N/A |
2 | RΘJB | Junction-to-board | 11.3 | N /A |
3 | RΘJA | Junction-to-free air | 23.9 | 0.00 |
4 | RΘJMA | Junction-to-moving air | 21.2 | 0.50 |
5 | 20.3 | 1.00 | ||
6 | 19.5 | 2.00 | ||
7 | 18.6 | 4.00 | ||
8 | PsiJT | Junction-to-package top | 0.2 | 0.00 |
9 | 0.3 | 0.50 | ||
10 | 0.3 | 1.00 | ||
11 | 0.4 | 2.00 | ||
12 | 0.5 | 4.00 | ||
13 | PsiJB | Junction-to-board | 11.2 | 0.00 |
14 | 11.1 | 0.50 | ||
15 | 11.1 | 1.00 | ||
16 | 11.0 | 2.00 | ||
17 | 10.9 | 4.00 |